LEADER 02056nam  2200325z- 450 
001 9910557450803321
005 20240322170129.0
035   $a(CKB)5400000000043231
035   $a(oapen)https://directory.doabooks.org/handle/20.500.12854/68873
035   $a(EXLCZ)995400000000043231
100   $a20202105d2020      |y         0
101 0 $aeng
135   $aurmn|---annan
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aAtomic Layer Deposition
210   $aBasel, Switzerland$cMDPI - Multidisciplinary Digital Publishing Institute$d2020
215   $a1 electronic resource (142 p.)
311   $a3-03936-652-1 
311   $a3-03936-653-X 
330   $aAtomic layer deposition (ALD) is a thin film deposition process renowned for its ability to produce layers with unrivaled control of thickness and composition, conformability to extreme three-dimensional structures, and versatility in the materials it can produce. These range from multi-component compounds to elemental metals and structures with compositions that can be adjusted over the thickness of the film. It has expanded from a small-scale batch process to large scale production, also including continuous processing ? known as spatial ALD. It has matured into an industrial technology essential for many areas of materials science and engineering from microelectronics to corrosion protection. Its attributes make it a key technology in studying new materials and structures over an enormous range of applications. This Special Issue contains six research articles and one review article that illustrate the breadth of these applications from energy storage in batteries or supercapacitors to catalysis via x-ray, UV, and visible optics.
606   $aResearch & information: general$2bicssc
615  7$aResearch & information: general
700   $aCameron$b David$4edt$0160398
702   $aCameron$b David$4oth
906   $aBOOK
912   $a9910557450803321
996   $aAtomic Layer Deposition$93029807
997   $aUNINA