LEADER 03883nam  2200817z- 450 
001 9910557401503321
005 20231214133639.0
035   $a(CKB)5400000000043662
035   $a(oapen)https://directory.doabooks.org/handle/20.500.12854/68490
035   $a(EXLCZ)995400000000043662
100   $a20202105d2021      |y             0
101 0 $aeng
135   $aurmn|---annan
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aLatest Advances in Electrothermal Models
210   $aBasel, Switzerland$cMDPI - Multidisciplinary Digital Publishing Institute$d2021
215   $a1 electronic resource (140 p.)
311   $a3-0365-0334-X 
311   $a3-0365-0335-8 
330   $aThis book is devoted to the latest advances in the area of electrothermal modelling of electronic components and networks. It contains eight sections by different teams of authors. These sections contain the results of: (a) electro-thermal simulations of SiC power MOSFETs using a SPICE-like simulation program; (b) modelling thermal properties of inductors taking into account the influence of the core volume on the efficiency of heat removal; (c) investigations into the problem of inserting a temperature sensor in the neighbourhood of a chip to monitor its junction temperature; (d) computations of the internal temperature of power LEDs situated in modules containing multiple-power LEDs, taking into account both self-heating in each power LED and mutual thermal couplings between each diode; (e) analyses of DC-DC converters using the electrothermal averaged model of the diode?transistor switch, including an IGBT and a rapid-switching diode; (f) electrothermal modelling of SiC power BJTs; (g) analysis of the efficiency of selected algorithms used for solving heat transfer problems at nanoscale; (h) analysis related to thermal simulation of the test structure dedicated to heat-diffusion investigation at the nanoscale.
606   $aHistory of engineering & technology$2bicssc
610   $aDual-Phase-Lag heat transfer model
610   $athermal simulation algorithm
610   $athermal measurements
610   $aFinite Difference Method scheme
610   $aGrünwald?Letnikov fractional derivative
610   $aKrylov subspace-based model order reduction
610   $aalgorithm efficiency analysis
610   $arelative error analysis
610   $aalgorithm convergence analysis
610   $acomputational complexity analysis
610   $afinite difference method scheme
610   $aBJT
610   $amodelling
610   $aself-heating
610   $asilicon carbide
610   $aSPICE
610   $aIGBT
610   $aDC?DC converter
610   $aelectrothermal model
610   $aaveraged model
610   $athermal phenomena
610   $adiode?transistor switch
610   $apower electronics
610   $amulti-LED lighting modules
610   $adevice thermal coupling
610   $acompact thermal models
610   $atemperature sensors
610   $amicroprocessor
610   $athroughput improvement
610   $ainductors
610   $aferromagnetic cores
610   $athermal model
610   $atransient thermal impedance
610   $athermal resistance
610   $aelectrothermal (ET) simulation
610   $afinite-element method (FEM)
610   $amodel-order reduction (MOR)
610   $amulticellular power MOSFET
610   $asilicon carbide (SiC)
615  7$aHistory of engineering & technology
700   $aGórecki$b Krzysztof$4edt$01302753
702   $aGórecki$b Pawe?$4edt
702   $aGórecki$b Krzysztof$4oth
702   $aGórecki$b Pawe?$4oth
906   $aBOOK
912   $a9910557401503321
996   $aLatest Advances in Electrothermal Models$93026515
997   $aUNINA