LEADER 00885nam0-22002891i-450 001 990004563270403321 005 20170307132029.0 035 $a000456327 035 $aFED01000456327 035 $a(Aleph)000456327FED01 035 $a000456327 100 $a19990604d1958----km-y0itay50------ba 101 0 $aeng 105 $ay-------001yy 200 1 $aDocuments from Old Testament times$ftraslated with introduction and notes by members of the Society for Old Testament Study$gand edited by D. Winton Thomas 210 $aLondon$cT. Nelson and Sons$d1958 215 $aXXVI, 302 p.$d25 cm 610 0 $aBibbia - Vecchio testamento 676 $a224 702 1$aThomas,$bDavid Winton 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990004563270403321 952 $a200/3 0263$bBibl. 31823$fFLFBC 959 $aFLFBC 996 $aBibbia$955323 997 $aUNINA LEADER 02723nam 2200493 450 001 9910555157103321 005 20221206103248.0 010 $a1-119-55664-3 010 $a1-119-55667-8 010 $a1-119-55665-1 024 7 $a10.1002/9781119556671 035 $a(CKB)4100000010563973 035 $a(MiAaPQ)EBC6128722 035 $a(CaBNVSL)mat09063370 035 $a(IDAMS)0b0000648c8c354a 035 $a(IEEE)9063370 035 $a(EXLCZ)994100000010563973 100 $a20200429d2020 uy 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$aAntenna-in-package technology and applications /$fedited by Duixian Liu, Yueping Zhang 205 $aFirst edition. 210 1$aHoboken, New Jersey :$cWiley-IEEE Press,$d[2020] 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2020] 215 $a1 online resource (518 pages) 311 $a1-119-55663-5 320 $aIncludes bibliographical references and index. 327 $aAntennas for AiP technology / Yueping Zhang -- Package technologies / Dr Ning Ye -- Electrical, mechanical, and thermal co-design / Xiaoxiong Gu and Pritish R Parida. 330 $a"This book starts with some historical notes about how AiP technology has evolved as we know it today. Then, the authors consider antennas and packages, thermal analysis and design, and measurement setups and methods for AiP technology. The authors show that the choice of antennas is usually given to those popular antennas that can be easily designed for the applications; the choice of packages is a trade-off among constraints such as electrical performance, thermo-mechanical reliability, compactness, manufacturability and cost; the choice of interconnects is governed by JEDEC for automatic assembly. Next, the book describes respectively low-temperature co-fired ceramic (LTCC), high-density interconnects (HDI), fan-out wafer level packaging (FOWLP) based AiP, and 3D-printing-based AiP. After that, the authors discuss in details the surface laminar circuit (SLC) based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Finally, the book touches on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications"--$cProvided by publisher. 606 $aMicrostrip antennas 615 0$aMicrostrip antennas. 676 $a621.3824 702 $aLiu$b Duixian 702 $aZhang$b Yueping 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910555157103321 996 $aAntenna-in-package technology and applications$92818891 997 $aUNINA