LEADER 04101nam 22005175 450 001 9910551838003321 005 20251113181943.0 010 $a3-030-93441-1 024 7 $a10.1007/978-3-030-93441-5 035 $a(MiAaPQ)EBC6899807 035 $a(Au-PeEL)EBL6899807 035 $a(OCoLC)1302009243 035 $a(CKB)21348183000041 035 $a(PPN)261520792 035 $a(DE-He213)978-3-030-93441-5 035 $a(EXLCZ)9921348183000041 100 $a20220301d2022 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aRecent Progress in Lead-Free Solder Technology $eMaterials Development, Processing and Performances /$fedited by Mohd Arif Anuar Mohd Salleh, Mohd Sharizal Abdul Aziz, Azman Jalar, Mohd Izrul Izwan Ramli 205 $a1st ed. 2022. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2022. 215 $a1 online resource (332 pages) 225 1 $aTopics in Mining, Metallurgy and Materials Engineering,$x2364-3307 311 08$aPrint version: Salleh, Mohd Arif Anuar Mohd Recent Progress in Lead-Free Solder Technology Cham : Springer International Publishing AG,c2022 9783030934408 320 $aIncludes bibliographical references and index. 327 $aRecent Studies in The Development of Ceramic Reinforced Lead-Free Composite Solder -- Development of Geopolymer Ceramic Reinforced Solder -- Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders -- Molecular Dynamic on the Nanoparticle Reinforcement into Lead-free Solder during Reflow Soldering Process -- Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics -- Advanced assembly of Miniaturized Surface Mount Technology Components using Nano-Reinforced Solder Paste -- Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi -- The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation & Experimental -- Flux Modification for Wettability and Reliability Improvement in Solder Joints -- Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints -- Significance of Interfacial Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint and Methods of IMC Layer Thickness Measurements -- The Effect of Laser Soldering onto Intermetallic Compound Formation and Growth -- Reliability Analysis on the Flexible Printed Circuit Board During Reflow Soldering -- Solder Paste?s Rheology Data for Stencil Printing Numerical Investigations -- Tin Whiskers Growth in Electronic Assemblies. 330 $aThis book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials? development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder. 410 0$aTopics in Mining, Metallurgy and Materials Engineering,$x2364-3307 606 $aMetals 606 $aMetals and Alloys 615 0$aMetals. 615 14$aMetals and Alloys. 676 $a671.56 676 $a671.56 702 $aAbdul Aziz$b Mohd Sharizal 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910551838003321 996 $aRecent Progress in Lead-Free Solder Technology$92802681 997 $aUNINA