LEADER 03048 am 2200505 n 450 001 9910548292003321 005 20211015 010 $a2-7535-8515-6 024 7 $a10.4000/books.pur.149840 035 $a(CKB)5670000000207014 035 $a(FrMaCLE)OB-pur-149840 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/86747 035 $a(PPN)267933614 035 $a(EXLCZ)995670000000207014 100 $a20220222j|||||||| ||| 0 101 0 $afre 135 $auu||||||m|||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aGénération Low-Cost $eItinéraires de jeunes migrants intra-européens /$fAurore Flipo 210 $aRennes $cPresses universitaires de Rennes$d2021 215 $a1 online resource (282 p.) 225 1 $aLe sens social 311 $a2-7535-5472-2 330 $aLa décennie écoulée a constitué une période d?intensification de la mobilité du travail en Europe, recouvrant un large spectre d?acteurs et de phénomènes sociaux. Que révèlent-ils de l?évolution de nos sociétés européennes ? C?est tout l?enjeux auquel cet ouvrage se propose de répondre. Basé sur l?analyse comparative des migrations récentes de jeunes Polonais au Royaume-Uni et de jeunes Roumains en Espagne, l?ouvrage questionne la place de la mobilité internationale dans le changement social contemporain. La mobilité n?est pas simplement le produit d?inégalités entre pays européens. Elle est également le résultat du processus de flexibilisation de l?emploi, en particulier non qualifié, dans le contexte d?une compétition accrue pour l?accès au marché du travail. Les jeunes migrants Européens, lourdement déclassés dans les pays d?accueil, constituent alors la face cachée de ce phénomène, alors même que les formes les plus légitimées de mobilité internationale (Erasmus, mobilité des cadres) sont promues et encouragées. En s?appuyant sur une enquête par entretiens, l?ouvrage s?intéresse aux conséquences de la mobilité sur les trajectoires, aussi bien professionnelles que personnelles, constitutives d?une instance de socialisation particulièrement marquante (l?entrée dans Ia vie adulte, et bien souvent, les premières expériences du monde du travail). Dans le contexte de la libre circulation, la possibilité d?aller et de venir peut être à la fois une chance et un piège, une opportunité et un risque, et c?est ce que nous tentons alors de comprendre. 606 $aEconomics 606 $aBusiness 606 $asociologie 606 $aéconomie 606 $agestion 610 $asociologie 610 $aéconomie 610 $agestion 615 4$aEconomics 615 4$aBusiness 615 4$asociologie 615 4$aéconomie 615 4$agestion 700 $aFlipo$b Aurore$01285192 801 0$bFR-FrMaCLE 906 $aBOOK 912 $a9910548292003321 996 $aGénération Low-Cost$93040620 997 $aUNINA LEADER 02378nam 2200517 a 450 001 9910789648203321 005 20230725032226.0 010 $a1-58901-799-4 035 $a(CKB)2670000000113644 035 $a(EBL)765476 035 $a(OCoLC)748242151 035 $a(SSID)ssj0000535017 035 $a(PQKBManifestationID)11325148 035 $a(PQKBTitleCode)TC0000535017 035 $a(PQKBWorkID)10521958 035 $a(PQKB)11659524 035 $a(MiAaPQ)EBC765476 035 $a(MdBmJHUP)muse892 035 $a(Au-PeEL)EBL765476 035 $a(CaPaEBR)ebr10497693 035 $a(EXLCZ)992670000000113644 100 $a20101216d2011 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aChristianity in evolution$b[electronic resource] $ean exploration /$fJack Mahoney 210 $aWashington, D.C. $cGeorgetown University Press$dc2011 215 $a1 online resource (203 p.) 300 $aDescription based upon print version of record. 311 $a1-58901-769-2 320 $aIncludes bibliographical references and index. 327 $aAccepting evolution -- Evolution, altruism, and the image of God -- The evolutionary achievement of Jesus -- Incarnation without the Fall -- Seeking a new paradigm -- The Church and the eucharist in evolution -- Theology in evolution. 330 $aEvolution has provided a new understanding of reality, with revolutionary consequences for Christianity. In an evolutionary perspective the incarnation involved God entering the evolving human species to help it imitate the trinitarian altruism in whose image it was created and counter its tendency to self-absorption. Primarily, however, the evolutionary achievement of Jesus was to confront and overcome death in an act of cosmic significance, ushering humanity into the culminating stage of its evolutionary destiny, the full sharing of God's inner life. Previously such doctrines as original sin 606 $aEvolution$xReligious aspects$xCatholic Church 615 0$aEvolution$xReligious aspects$xCatholic Church. 676 $a231.7/652 700 $aMahoney$b John$f1931-$0250673 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910789648203321 996 $aChristianity in evolution$93732061 997 $aUNINA LEADER 05400nam 22007455 450 001 9910163046303321 005 20251116171202.0 010 $a3-319-44586-3 024 7 $a10.1007/978-3-319-44586-1 035 $a(CKB)3710000001041152 035 $a(DE-He213)978-3-319-44586-1 035 $a(MiAaPQ)EBC4791270 035 $a(PPN)198340702 035 $a(EXLCZ)993710000001041152 100 $a20170125d2017 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D Microelectronic Packaging $eFrom Fundamentals to Applications /$fedited by Yan Li, Deepak Goyal 205 $a1st ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) 225 1 $aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v57 311 08$a3-319-44584-7 320 $aIncludes bibliographical references and index. 327 $aIntroduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . 330 $aThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology. 410 0$aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v57 606 $aElectronics 606 $aMicroelectronics 606 $aOptical materials 606 $aElectronics$xMaterials 606 $aElectronic circuits 606 $aBiotechnology 606 $aNanotechnology 606 $aMetals 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aMicroengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/C12040 606 $aNanotechnology and Microengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T18000 606 $aMetallic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z16000 615 0$aElectronics. 615 0$aMicroelectronics. 615 0$aOptical materials. 615 0$aElectronics$xMaterials. 615 0$aElectronic circuits. 615 0$aBiotechnology. 615 0$aNanotechnology. 615 0$aMetals. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aOptical and Electronic Materials. 615 24$aElectronic Circuits and Devices. 615 24$aMicroengineering. 615 24$aNanotechnology and Microengineering. 615 24$aMetallic Materials. 676 $a621.381 702 $aLi$b Yan$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aGoyal$b Deepak$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910163046303321 996 $a3D Microelectronic Packaging$91934663 997 $aUNINA