LEADER 04100nam 2200649 450 001 9910484726403321 005 20221007182608.0 010 $a981-15-7090-6 024 7 $a10.1007/978-981-15-7090-2 035 $a(CKB)4100000011610042 035 $a(MiAaPQ)EBC6407627 035 $a(DE-He213)978-981-15-7090-2 035 $a(PPN)252503961 035 $a(EXLCZ)994100000011610042 100 $a20210306d2021 fy 0 101 0 $aeng 135 $aurnn#---mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$a3D microelectronic packaging $efrom architectures to applications /$feditors, Yan Li, Deepak Goyal 205 $a2nd edition 2021. 210 1$aSingapore :$cSpringer,$d[2021] 210 4$d©2021 215 $a1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) 225 1 $aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v64 300 $aIncludes index. 311 1 $a981-15-7089-2 327 $a1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. 330 $aThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development. . 410 0$aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v64 606 $aBiotechnology 606 $aElectronics 606 $aElectronics$xMaterials 606 $aMicroelectronics 606 $aMicroelectronics$xPackaging 606 $aNanotechnology 606 $aElectronic circuits 606 $aOptical materials 615 0$aBiotechnology. 615 0$aElectronics. 615 0$aElectronics$xMaterials. 615 0$aMicroelectronics. 615 0$aMicroelectronics$xPackaging. 615 0$aNanotechnology. 615 0$aElectronic circuits. 615 0$aOptical materials. 676 $a929.374 702 $aGoyal$b Deepak 702 $aLi$b Yan 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910484726403321 996 $a3D Microelectronic Packaging$91934663 997 $aUNINA LEADER 04185nam 22006855 450 001 9910300084903321 005 20250714110238.0 010 $a1-4471-5484-3 024 7 $a10.1007/978-1-4471-5484-6 035 $a(CKB)3710000000024870 035 $a(EBL)1466457 035 $a(OCoLC)861080791 035 $a(SSID)ssj0001010572 035 $a(PQKBManifestationID)11636628 035 $a(PQKBTitleCode)TC0001010572 035 $a(PQKBWorkID)11018144 035 $a(PQKB)10640228 035 $a(MiAaPQ)EBC1466457 035 $a(DE-He213)978-1-4471-5484-6 035 $a(PPN)172418224 035 $a(EXLCZ)993710000000024870 100 $a20130930d2014 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aSurgical Management of Benign Esophageal Disorders $eThe ?Chicago Approach? /$fedited by P. Marco Fisichella, Nathaniel J. Soper, Carlos A. Pellegrini, Marco G. Patti 205 $a1st ed. 2014. 210 1$aLondon :$cSpringer London :$cImprint: Springer,$d2014. 215 $a1 online resource (260 p.) 300 $aDescription based upon print version of record. 311 08$a1-4471-5483-5 320 $aIncludes bibliographical references and index. 327 $a 1. Esophageal anatomy for physiology for the surgeon.- 2. Pathophysiology of Gastroesophageal Reflux Disease (GERD).- 3. The Chicago Classification system of esophageal motility disorders.- 4. Gastroesphagal Reflux Disease: Preoperative evaluation -- 5. Surgery for esophageal disorders: the anesthesiologist view -- 6. Treatment of epiphrenic diverticula -- 7. Head and Neck Manifestations of Gastroesophageal Reflux Disease -- 8. Minimally invasive treatment of GERD -- 9. Minimally invasive treatment of GERD: special situations -- 10. Endoscopic treatment of GERD -- 11. Endoscopic Management of Achalasia -- 12. Surgical treatment of Esophageal achalasia -- 13. Paraesophageal hernias: indications and surgical treatment -- 14. Minimally invasive treatment of benign esophageal tumors -- 15. Barrett?s esophagus: treatment options and management -- 16. Surgery for Barrett?s esophagus: from metaplasia to cancer -- 17. Revisional surgery: Achalasia -- 18. Failed antireflux surgery: Analysis of the causes and treatment. 330 $aSurgical Management of Benign Esophageal Disorders: The "Chicago Approach" brings together all stages of the diagnosis and treatment of the most common benign esophageal disorders. Based on both evidence-based data and experience, this book focuses on the specific topics and issues of these disorders, whilst analyzing the key elements for the successful management of the patients. Emerging laparoscopic, thoracoscopic and endoscopic procedures are closely looked at, as well as patient preparation, operative techniques and strategies for avoiding and managing complications.   Written by world leading esophageal surgeons and gastroenterologists, Surgical Management of Benign Esophageal Disorders: The "Chicago Approach" will render esophageal diseases more understandable and accessible to medical students, residents, fellows and physicians both in the surgical disciplines and in gastroenterology. 606 $aSurgery 606 $aGastroenterology 606 $aEndoscopic surgery 606 $aSurgery 606 $aGastroenterology 606 $aMinimally Invasive Surgery 615 0$aSurgery. 615 0$aGastroenterology. 615 0$aEndoscopic surgery. 615 14$aSurgery. 615 24$aGastroenterology. 615 24$aMinimally Invasive Surgery. 676 $a610 676 $a616.33 676 $a617 676 $a617.05 702 $aFisichella$b P. Marco$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aSoper$b Nathaniel J$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aPellegrini$b Carlos A$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aPatti$b Marco G$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910300084903321 996 $aSurgical Management of Benign Esophageal Disorders$91522039 997 $aUNINA