LEADER 04100nam 2200649 450 001 9910484726403321 005 20221007182608.0 010 $a981-15-7090-6 024 7 $a10.1007/978-981-15-7090-2 035 $a(CKB)4100000011610042 035 $a(MiAaPQ)EBC6407627 035 $a(DE-He213)978-981-15-7090-2 035 $a(PPN)252503961 035 $a(EXLCZ)994100000011610042 100 $a20210306d2021 fy 0 101 0 $aeng 135 $aurnn#---mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 00$a3D microelectronic packaging $efrom architectures to applications /$feditors, Yan Li, Deepak Goyal 205 $a2nd edition 2021. 210 1$aSingapore :$cSpringer,$d[2021] 210 4$d©2021 215 $a1 online resource (XVII, 622 p. 299 illus., 205 illus. in color.) 225 1 $aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v64 300 $aIncludes index. 311 1 $a981-15-7089-2 327 $a1. Introduction to 3D microelectronic packaging -- 2. 3D packaging architecture and assembly process design -- 3. Fundamentals of TSV processing and reliability -- 4. Mechanical properties of TSV -- 5. Atomistic View of TSV Protrusion/Intrusion -- 6. Fundamentals and failures in Die preparation for 3D packaging -- 7. Direct Cu to Cu bonding and other alternative interconnects in 3D packaging -- 8. Emerging hybrid bonding techniques for 3D packaging -- 9. Fundamental of Thermal Compressive Bonding process, advanced epoxy, and flux materials in 3D packaging -- 10. Fundamentals of solder alloys in 3D packaging -- 11. Fundamentals of electro migration in interconnects of 3D packages -- 12. Fundamentals of heat dissipation in 3D packaging -- 13. Fundamentals of advanced materials and process in substrate technology -- 14. New substrate technologies for 3D packaging. -15. Thermal mechanical and moisture modeling in 3D packaging -- 16. Stress and Strain measurements in 3D packaging -- 17.Processing and Reliability of Solder Interconnections in Stacked Packaging -- 18. Interconnect Quality and Reliability of 3D Packaging -- 19. Fundamentals of automotive reliability of 3D packages -- 20. Fault isolation and failure analysis of 3D packaging. 330 $aThis book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. 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A Brief Overview of the Manhattan Project -- Chapter 2. Manhattan Project Encyclopedia -- Chapter 3. Chronology. 330 $aThis book provides a guide to the people, places, artifacts, events, terminology, scientific concepts, groups, critical documents, and code phrases associated with the Manhattan Project. It is of interest to all readers/researchers (students, journalists, policy-makers, specialist and non-specialist instructors and scientists) who need to rapidly access authoritative, self-contained definitions/descriptions of such items and references to authoritative sources. 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