LEADER 03357oam 2200721I 450 001 9910462897103321 005 20200520144314.0 010 $a1-315-21637-X 010 $a1-4665-1604-6 024 7 $a10.1201/b14197 035 $a(CKB)2670000000341611 035 $a(EBL)1153205 035 $a(OCoLC)831118556 035 $a(SSID)ssj0000853019 035 $a(PQKBManifestationID)11453652 035 $a(PQKBTitleCode)TC0000853019 035 $a(PQKBWorkID)10854768 035 $a(PQKB)10815252 035 $a(MiAaPQ)EBC1153205 035 $a(CaSebORM)9781466516045 035 $a(MiAaPQ)EBC4009648 035 $a(Au-PeEL)EBL1153205 035 $a(CaPaEBR)ebr10674486 035 $a(CaONFJC)MIL501543 035 $a(OCoLC)859403863 035 $a(Au-PeEL)EBL4009648 035 $a(EXLCZ)992670000000341611 100 $a20180331d2013 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHigh-speed photonics interconnects /$fedited by Lukas Chrostowski, Krzysztof Iniewski 205 $a1st edition 210 1$aBoca Raton, Fla. :$cTaylor & Francis,$d2013. 215 $a1 online resource (217 p.) 225 1 $aDevices, Circuits, and Systems 300 $aDescription based upon print version of record. 311 $a1-138-07159-5 311 $a1-4665-1603-8 320 $aIncludes bibliographical references. 327 $aFront Cover; Contents; Preface; Editors; Contributors; Chapter 1 - Energy-Efficient Photonic Interconnects for Computing Platforms; Chapter 2 - Low-Loss, High-Performance Chip-to-Chip Electrical Connectivity Using Air-Clad Copper Interconnects; Chapter 3 - Silicon Photonic Bragg Gratings; Chapter 4 - Lasers for Optical Interconnects; Chapter 5 - Vertical-Cavity Surface-Emitting Lasers for Interconnects; Chapter 6 - High-Speed Photodiodes and Laser Power Converters for the Applications of Green Optical Interconnect; Chapter 7 - Quantum-Dot Nanophotonics for Photodetection 327 $aChapter 8 - Rolled-Up Semiconductor Tube Optical CavitiesBack Cover 330 $aThe book is designed to achieve two goals. It assembles the latest research in the field of photonics interconnects technology and exposes the reader to the myriad applications that this technology has enabled. The book is mean for advanced graduate researchers, as well as for academicians and professional researchers. Composed of work from experts at leading academic institutions and semiconductor companies, such as Intel, PMC-Sierra, and Vittesse, this resource will have a widespread appeal, as it requires minimal math and contains numerous illustrations--$cProvided by publisher. 410 0$aDevices, circuits, and systems. 606 $aInterconnects (Integrated circuit technology) 606 $aOptical interconnects 606 $aPhotonics 608 $aElectronic books. 615 0$aInterconnects (Integrated circuit technology) 615 0$aOptical interconnects. 615 0$aPhotonics. 676 $a621.36/5 701 $aChrostowski$b Lukas$01052948 701 $aIniewski$b Krzysztof$0845507 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910462897103321 996 $aHigh-speed photonics interconnects$92484510 997 $aUNINA LEADER 03193nam 22006735 450 001 9910484068203321 005 20250612114810.0 010 $a3-319-59888-0 024 7 $a10.1007/978-3-319-59888-8 035 $a(CKB)4340000000061566 035 $a(DE-He213)978-3-319-59888-8 035 $a(MiAaPQ)EBC5592745 035 $a(PPN)20299077X 035 $a(EXLCZ)994340000000061566 100 $a20170526d2017 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aLanguage, Data, and Knowledge $eFirst International Conference, LDK 2017, Galway, Ireland, June 19-20, 2017, Proceedings /$fedited by Jorge Gracia, Francis Bond, John P. McCrae, Paul Buitelaar, Christian Chiarcos, Sebastian Hellmann 205 $a1st ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (XIII, 396 p. 106 illus.) 225 1 $aLecture Notes in Artificial Intelligence,$x2945-9141 ;$v10318 311 08$a3-319-59887-2 327 $aLanguage data -- Knowledge graphs -- Applications in NLP -- Use cases in digital humanities, social sciences, and BioNLP. 330 $aThis book constitutes the proceedings of the First International Conference on Language, Data and Knowledge, LDK 2017, held in Galway, Ireland, in June 2017. The 14 full papers and 19 short papers included in this volume were carefully reviewed and selected from 68 initial submissions. 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