LEADER 02527nam 2200469 450 001 9910483477703321 005 20220927194305.0 010 $a981-16-1376-1 024 7 $a10.1007/978-981-16-1376-0 035 $a(CKB)4100000011930488 035 $a(DE-He213)978-981-16-1376-0 035 $a(MiAaPQ)EBC6627540 035 $a(Au-PeEL)EBL6627540 035 $a(OCoLC)1252421476 035 $a(PPN)255888066 035 $a(EXLCZ)994100000011930488 100 $a20220122d2021 uy 0 101 0 $aeng 135 $aurnn#008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aSemiconductor advanced packaging /$fJohn H. Lau 205 $a1st ed. 2021. 210 1$aGateway East, Singapore :$cSpringer,$d[2021] 210 4$d©2021 215 $a1 online resource (XXII, 498 p. 557 illus., 530 illus. in color.) 311 $a981-16-1375-3 320 $aIncludes bibliographical references and index. 327 $aRecent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. 330 $aThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. 606 $aSemiconductors$xDesign and construction 615 0$aSemiconductors$xDesign and construction. 676 $a621.38152 700 $aLau$b John H.$0972648 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910483477703321 996 $aSemiconductor Advanced Packaging$92212364 997 $aUNINA LEADER 01567nam 2200385Ia 450 001 996386804503316 005 20221108080349.0 035 $a(CKB)4940000000083062 035 $a(EEBO)2240882232 035 $a(OCoLC)18409415 035 $a(EXLCZ)994940000000083062 100 $a19880826d1691 uy | 101 0 $aeng 135 $aurbn||||a|bb| 200 14$aThe forerunner to a further answer (if need be) to two books lately published against Tho. Grantham of Norwich$b[electronic resource] $ewherein the spirit and temper of the Calvinists is discovered, particularly Mr. Calvin, Mr. Finch, and his little pręcursor : to which is prefixed, the solid testimony of Mr. George Wither, against Calvinism, the worst of doctrines /$fby Tho. Grantham .. 210 $a[London? $cs.n.$d1691] 215 $a7 p 300 $aCaption title. 300 $aPlace and date of publication suggested by Wing. 300 $aImperfect : stained and slightly faded. 300 $aReproduction of original in the British Library. 330 $aeebo-0018 606 $aCalvinism$vControversial literature 606 $aBaptists$vApologetic works 615 0$aCalvinism 615 0$aBaptists 700 $aGrantham$b Thomas$f1634-1692.$01003702 701 $aWither$b George$f1588-1667.$01001083 801 0$bEAJ 801 1$bEAJ 801 2$bWaOLN 906 $aBOOK 912 $a996386804503316 996 $aThe forerunner to a further answer (if need be) to two books lately published against Tho. Grantham of Norwich$92385425 997 $aUNISA