LEADER 02527nam 2200469 450 001 9910483477703321 005 20220927194305.0 010 $a981-16-1376-1 024 7 $a10.1007/978-981-16-1376-0 035 $a(CKB)4100000011930488 035 $a(DE-He213)978-981-16-1376-0 035 $a(MiAaPQ)EBC6627540 035 $a(Au-PeEL)EBL6627540 035 $a(OCoLC)1252421476 035 $a(PPN)255888066 035 $a(EXLCZ)994100000011930488 100 $a20220122d2021 uy 0 101 0 $aeng 135 $aurnn#008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aSemiconductor advanced packaging /$fJohn H. Lau 205 $a1st ed. 2021. 210 1$aGateway East, Singapore :$cSpringer,$d[2021] 210 4$dİ2021 215 $a1 online resource (XXII, 498 p. 557 illus., 530 illus. in color.) 311 $a981-16-1375-3 320 $aIncludes bibliographical references and index. 327 $aRecent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. 330 $aThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. 606 $aSemiconductors$xDesign and construction 615 0$aSemiconductors$xDesign and construction. 676 $a621.38152 700 $aLau$b John H.$0972648 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910483477703321 996 $aSemiconductor Advanced Packaging$92212364 997 $aUNINA