LEADER 05770nam 2200769Ia 450 001 9910825297303321 005 20200520144314.0 010 $a9786613620637 010 $a9781119966869 010 $a1119966868 010 $a9781119963677 010 $a1119963672 010 $a9781280590801 010 $a1280590807 010 $a9781119963240 010 $a1119963249 035 $a(CKB)2670000000151527 035 $a(EBL)865036 035 $a(OCoLC)778448543 035 $a(SSID)ssj0000611242 035 $a(PQKBManifestationID)11368389 035 $a(PQKBTitleCode)TC0000611242 035 $a(PQKBWorkID)10646642 035 $a(PQKB)10604432 035 $a(MiAaPQ)EBC865036 035 $a(Au-PeEL)EBL865036 035 $a(CaPaEBR)ebr10538596 035 $a(CaONFJC)MIL362063 035 $a(Perlego)1000805 035 $a(EXLCZ)992670000000151527 100 $a20111020d2012 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aAdvanced interconnects for ULSI technology /$fedited by Mikhail Baklanov, Paul S. Ho and Ehrenfried Zschech 205 $a2nd ed. 210 $aChichester, West Susex $cWiley$d2012 215 $a1 online resource (615 p.) 300 $aDescription based upon print version of record. 311 08$a9780470662540 311 08$a0470662549 320 $aIncludes bibliographical references and index. 327 $aAdvanced Interconnects for ULSI Technology; Contents; About the Editors; List of Contributors; Preface; Abbreviations; Section I Low-k Materials; 1 Low-k Materials: Recent Advances; 1.1 Introduction; 1.2 Integration Challenges; 1.2.1 Process-Induced Damage; 1.2.2 Mechanical Properties; 1.3 Processing Approaches to Existing Integration Issues; 1.3.1 Post-deposition Treatments; 1.3.2 Prevention or Repair of Plasma-Induced Processing Damage; 1.3.3 Multilayer Structures; 1.4 Material Advances to Overcome Current Limitations; 1.4.1 Silica Zeolites; 1.4.2 Hybrid Organic-Inorganic: Oxycarbosilanes 327 $a1.5 ConclusionReferences; 2 Ultra-Low-k by CVD: Deposition and Curing; 2.1 Introduction; 2.2 Porogen Approach by PECVD; 2.2.1 Precursors and Deposition Conditions; 2.2.2 Mystery Still Unsolved: From Porogens to Pores; 2.3 UV Curing; 2.3.1 General Overview of Curing; 2.3.2 UV Curing Mechanisms; 2.4 Impact of Curing on Structure and Physical Properties: Benefits of UV Curing; 2.4.1 Porosity; 2.4.2 Chemical Structure and Mechanical Properties; 2.4.3 Electrical Properties; 2.5 Limit/Issues with the Porogen Approach; 2.5.1 Porosity Creation Limit; 2.5.2 Porogen Residues; 2.6 Future of CVD Low-k 327 $a2.6.1 New Matrix Precursor2.6.2 Other Deposition Strategies; 2.6.3 New Deposition Techniques; 2.7 Material Engineering: Adaptation to Integration Schemes; 2.8 Conclusion; References; 3 Plasma Processing of Low-k Dielectrics; 3.1 Introduction; 3.2 Materials and Equipment; 3.3 Process Results Characterization; 3.4 Interaction of Low-k Dielectrics with Plasma; 3.4.1 Low-k Etch Chemistries; 3.4.2 Patterning Strategies and Masking Materials; 3.4.3 Etch Mechanisms; 3.5 Mechanisms of Plasma Damage; 3.5.1 Gap Structure Studies; 3.5.2 Effect of Radical Density; 3.5.3 Effect of Ion Energy 327 $a3.5.4 Effect of Photon Energy and Intensity3.5.5 Plasma Damage by Oxidative Radicals; 3.5.6 Hydrogen-Based Plasma; 3.5.7 Minimization of Plasma Damage; 3.6 Dielectric Recovery; 3.6.1 CH4 Beam Treatment; 3.6.2 Dielectric Recovery by Silylation; 3.6.3 UV Radiation; 3.7 Conclusions; References; 4 Wet Clean Applications in Porous Low-k Patterning Processes; 4.1 Introduction; 4.2 Silica and Porous Hybrid Dielectric Materials; 4.3 Impact of Plasma and Subsequent Wet Clean Processes on the Stability of Porous Low-k Dielectrics; 4.3.1 Stability in Pure Chemical Solutions 327 $a4.3.2 Stability in Commercial Chemistries4.3.3 Hydrophobicity of Hybrid Low-k Materials; 4.4 Removal of Post-Etch Residues and Copper Surface Cleaning; 4.5 Plasma Modification and Removal of Post-Etch 193 nm Photoresist; 4.5.1 Modification of 193 nm Photoresist by Plasma Etch; 4.5.2 Wet Removal of 193 nm Photoresist; Acknowledgments; References; Section II Conductive Layers and Barriers; 5 Copper Electroplating for On-Chip Metallization; 5.1 Introduction; 5.2 Copper Electroplating Techniques; 5.3 Copper Electroplating Superfill; 5.3.1 The Role of Accelerator; 5.3.2 The Role of Suppressor 327 $a5.3.3 The Role of Leveler 330 $aFinding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical 606 $aIntegrated circuits$xUltra large scale integration 606 $aInterconnects (Integrated circuit technology) 615 0$aIntegrated circuits$xUltra large scale integration. 615 0$aInterconnects (Integrated circuit technology) 676 $a621.39/5 686 $aTEC008050$2bisacsh 701 $aBaklanov$b Mikhail$01628643 701 $aHo$b P. S$01676329 701 $aZschech$b Ehrenfried$0950028 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910825297303321 996 $aAdvanced interconnects for ULSI technology$94042447 997 $aUNINA LEADER 06442nam 22007575 450 001 9910473452803321 005 20251010074955.0 010 $a981-15-8848-1 024 7 $a10.1007/978-981-15-8848-8 035 $a(CKB)4900000000508923 035 $a(MiAaPQ)EBC6466935 035 $a(Au-PeEL)EBL6466935 035 $a(OCoLC)1236268309 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/63699 035 $a(ODN)ODN0010068954 035 $a(oapen)doab63699 035 $a(DE-He213)978-981-15-8848-8 035 $a(EXLCZ)994900000000508923 100 $a20210201d2021 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aFrontiers of Real Estate Science in Japan /$fedited by Yasushi Asami, Yoshiro Higano, Hideo Fukui 205 $a1st ed. 2021. 210 1$aSingapore :$cSpringer Nature Singapore :$cImprint: Springer,$d2021. 215 $a1 online resource (335 pages) 225 1 $aNew Frontiers in Regional Science: Asian Perspectives,$x2199-5982 ;$v29 311 08$a981-15-8847-3 327 $aPart 1. Real Estate and the Legal System -- Chapter 1. Introduction: Real Estate and the Legal System Japan -- Chapter 2. Legal issues of land plots with unknown owners -- Chapter 3. The efficiency of the titling system: Perspectives of Economics -- Chapter 4. Land plots with unknown owners: Causes and legal measures ? The necessity for a thorough reduction of transaction costs -- Chapter 5. Realities and Challenges of Land Issues in the Era of Depopulation -- Chapter 6. The Negative Effect Factors of the Land Acquisition System for Profit-Oriented Enterprises in order to Promote Economic Growth -- Chapter 7. Empirical analysis on the system revisions of judicial real estate auctions - Comparison with general real estate trading -- Part 2. Real estate tax system and real estate market in Japan -- Chapter 8. Introduction: Real estate tax system and real estate market in Japan -- Chapter 9. Professional Practices in Fixed Assets Valuation and Assessor Education in North America ? Suggestions for Japan -- Chapter 10. The Optimal Reform about Property Tax -- Chapter 11. Requirements for the application of exemption from real estate acquisition tax due to purpose of use ? Based on the acquisition of land usage for a school site by an Incorporated Educational Institution -- Chapter 12. Dual agency, commission levels, and the e?ect on sale price in residential real estate market: a questionnaire survey on real estate brokers in Japan -- Chapter 13. A study on the relation between residential land value and the distance to the center of the Tokyo Metropolitan Area (1970-2016) -- Chapter 14. Study on Premium Rent of Refurbished Apartments Based on Bayesian Modelling Using Stated Preference Data of the Tenants -- Chapter 15. Feasibility Evaluation for Condominium Reconstruction by Means of the Application of Discriminant Analysis on Real Estate Data -- Chapter 16. Factor Analysis of Rent Using Space Syntax Measures. - Comparative Analysis by Building Usearound Shibuya Station -- Part 3. City planning and new technology -- Chapter 17. Introduction: City planning and new technology -- Chapter 18. Guiding urban facilities and functions in compact mixed-use development from the perspective of residents -- Chapter 19. Compact city corresponding to the advanced transport systems -- Chapter 20. Current status and issues for urban (regional area) formulation of the Location Normalization Plan: the case of Niigata City -- Chapter 21. The Overview and Legal Issues Regarding Real Estate Tech -- Chapter 22. Proposal of System for Calculating Sky View Factor Using Google Street View -- Chapter 23. Frontiers of Computer Vision Technologies on Real Estate Property Photographs and Floorplans. . 330 $aThis Open Access book presents recent research and hot topics in the field of real estate science in Japan. It features carefully selected English translations of peer-reviewed papers and excellent articles published in the Japanese Journal of Real Estate Sciences, as well as papers presented at the Japan Association of Real Estate Sciences (JARES) annual conference. The topics covered include market analyses of vacant houses, policies for reuse of vacant houses, property tax policy, issues of land for which the owners are unknown, disaster and real estate values, the siting optimization plan and its influence on real estate, big data and ICT technology for the real estate business, and public real estate management. Real estate science in Japan has developed in step with international research in the fields of law and economics, regional science, civil engineering, environmental science, architectonics, and related areas. At the same time, it has evolved into a unique discipline that focuses on policy-oriented practical science with arguments for the reform of outdated laws, regulations, and traditional customs. Asian countries are currently growing rapidly and are catching up with developing countries. The lessons learned and know-how accumulated by JARES is helpful for practitioners and policymakers not only in Japan, but also in other Asian countries. 410 0$aNew Frontiers in Regional Science: Asian Perspectives,$x2199-5982 ;$v29 606 $aLaw and economics 606 $aUrban economics 606 $aAdministrative law 606 $aPolitical planning 606 $aMarketing 606 $aLaw and Economics 606 $aUrban Economics 606 $aAdministrative Law 606 $aPublic Policy 606 $aMarketing 615 0$aLaw and economics. 615 0$aUrban economics. 615 0$aAdministrative law. 615 0$aPolitical planning. 615 0$aMarketing. 615 14$aLaw and Economics. 615 24$aUrban Economics. 615 24$aAdministrative Law. 615 24$aPublic Policy. 615 24$aMarketing. 676 $a343.07 676 $a338.9 686 $aBUS043000$aBUS067000$aLAW001000$aLAW014000$aPOL028000$2bisacsh 700 $aAsami$b Yasushi$0849609 701 $aHigano$b Yoshiro$0849610 701 $aFukui$b Hideo$0849611 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910473452803321 996 $aFrontiers of Real Estate Science in Japan$91897244 997 $aUNINA