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010   $a9789811201110$q(set)
010   $a9789811201127$q(set 1 ; vol. 1)
010   $a9789811201134$q(set 1 ; vol. 2)
010   $a9789811201141$q(set 1 ; vol. 3)
010   $a9789811201158$q(set 1 ; vol. 4)
100   $a20210519d2020--------kmuy0itay5050----ba
101 0 $aeng
102   $aUS
200 1 $aEncyclopedia of packaging materials, processes, and mechanics$feditors-in-chief, Avram Bar-Cohen, Jeffrey C. Suhling,, Andrew A. O. Tay
210  1$aHackensack, New Jersey :$cWorld Scientific Publishing Co. Pte. Ltd.,$d[2020]
215   $a4 volumes$cill.$d25 cm
320   $aIncludes bibliographical references and index.
327   $avolume 1. Flip-chip and underfill materials and technology / editors, Pengli Zhu, Gang Li, C. P. Wong$avolume 2. Wire bonding technology / editors, Dae Young Jung, Stephen R. Cain, William (Bill) T. Chen, Bahgat G. Sammakia$avolume 3. Flexible chip I/O interconnects / editors, Muhannad S. Bakir, Suresh K. Sitaramanof$avolume 4. Wafer bonding technology / Kuan-Neng Chen, Chuan Seng Tan
610 0 $aPackaging
676   $a688.8
702  1$aBar-Cohen,$bAvram
702  1$aSuhling,$bJeffrey C.
702  1$aTay,$bAndrew A. O.
801  0$aIT$bUNINA$gRICA$2UNIMARC
901   $aBK
912   $a9910471755603321
952   $a13 SC V L 19$b3617 / 2021$fFINBC
952   $a13 SC V L 20$b3618 / 2021$fFINBC
952   $a13 SC V L 21$b3619 / 2021$fFINBC
952   $a13 SC V L 22$b3620 / 2021$fFINBC
959   $aFINBC
996   $aEncyclopedia of packaging materials, processes, and mechanics$91779985
997   $aUNINA