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100   $a20160314h20152015  uy|            0
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181   $ctxt
182   $cc
183   $acr
200 10$aISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis $eNovember 1-5 2015, Oregon Convention Center, Portland, Oregon, USA /$forganized by ISTFA/2015, Electronic Device Failure Analysis Society (EDFAS), ASM International
210  1$aMaterials Park, Ohio :$cASM International,$d[2015]
210  4$dİ2015
215   $a1 online resource (536 pages) $cillustrations (some color)
300   $aCover title.
311   $a1-62708-102-X 
606   $aElectronics$xMaterials$xTesting$vCongresses
606   $aMaterials$xTesting$vCongresses
606   $aElectronic apparatus and appliances$xTesting$vCongresses
606   $aSemiconductors$xTesting$vCongresses
608   $aElectronic books.
615  0$aElectronics$xMaterials$xTesting
615  0$aMaterials$xTesting
615  0$aElectronic apparatus and appliances$xTesting
615  0$aSemiconductors$xTesting
712 02$aASM International,
712 02$aElectronic Device Failure Analysis Society,
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910467594603321
996   $aISTFA 2015 conference proceedings from the 41st International Symposium for Testing and Failure Analysis$91978750
997   $aUNINA