LEADER 03754nam 2200565 450 001 9910466296103321 005 20200520144314.0 010 $a1-5015-0575-0 010 $a1-5015-0581-5 024 7 $a10.1515/9781501505751 035 $a(CKB)3710000001091946 035 $a(MiAaPQ)EBC4822115 035 $a(DE-B1597)477970 035 $a(OCoLC)979743573 035 $a(DE-B1597)9781501505751 035 $a(Au-PeEL)EBL4822115 035 $a(CaPaEBR)ebr11360472 035 $a(OCoLC)979153849 035 $a(EXLCZ)993710000001091946 100 $a20170327h20172017 uy 0 101 0 $aeng 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aHarnessing the UEFI shell $emoving the platform beyond DOS /$fMichael Rothman, Vincent Zimmer, Tim Lewis 205 $aSecond edition. 210 1$aBoston, [Massachusetts] ;$aBerlin, [Germany] :$cDe|G Press,$d2017. 210 4$d?2017 215 $a1 online resource (326 pages) $cillustrations 300 $aIncludes index. 311 $a1-5015-1480-6 327 $tFrontmatter -- $tPreface -- $tContents -- $tChapter 1. Introduction -- $tChapter 2. Under the UEFI Shell -- $tChapter 3. What Is the UEFI Shell? -- $tChapter 4. Why We Need an Execution Environment before the OS -- $tChapter 5. Manufacturing -- $tChapter 6. Bare Metal Provisionig -- $tChapter 7. Configuration of Provisioned Material -- $tChapter 8. The Use of UEFI for Diagnostics -- $tChapter 9. UEFI Shell Scripting -- $tChapter 10. UEFI Shell Programming -- $tChapter 11. Managing UEFI Drivers Using the Shell -- $tAppendix A. Security Considerations -- $tAppendix B. Command Reference -- $tAppendix C. Programming Reference -- $tAppendix D. UEFI Shell Library -- $tIndex 330 $aFocusing on the use of the UEFI Shell and its recently released formal specification, this book unlocks a wide range of usage models which can help people best utilize the shell solutions. This text also expands on the obvious intended utilization of the shell and explains how it can be used in various areas such as security, networking, configuration, and other anticipated uses such as manufacturing, diagnostics, etc. Among other topics, Harnessing the UEFI Shell demonstrates how to write Shell scripts, how to write a Shell application, how to use provisioning options and more. Since the Shell is also a UEFI component, the book will make clear how the two things interoperate and how both Shell developers as well as UEFI developers can dip into the other's field to further expand the power of their solutions. Harnessing the UEFI Shell is authored by the three chairs of the UEFI working sub-teams, Michael Rothman (Intel, chair of the UEFI Configuration and UEFI Shell sub-teams), Vincent Zimmer (Intel, chair of the UEFI networking sub-team and security sub-team), and Tim Lewis (Insyde Software, chair of the UEFI security sub-team). This book is perfect for any OEMs that ship UEFI-based solutions (which is all of the MNCs such as IBM, Dell, HP, Apple, etc.), software developers who are focused on delivering solutions targeted to manufacturing, diagnostics, hobbyists, or stand-alone kiosk environments. 606 $aComputer firmware 606 $aCommand languages (Computer science) 608 $aElectronic books. 615 0$aComputer firmware. 615 0$aCommand languages (Computer science) 676 $a005.434 700 $aRothman$b Michael$f1969-$01033727 702 $aZimmer$b Vincent 702 $aLewis$b Tim$f1968- 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910466296103321 996 $aHarnessing the UEFI shell$92452420 997 $aUNINA LEADER 05093nam 2200697Ia 450 001 9910454347303321 005 20200520144314.0 010 $a1-281-93444-5 010 $a9786611934446 010 $a981-279-450-6 035 $a(CKB)1000000000537851 035 $a(EBL)1679613 035 $a(OCoLC)879023733 035 $a(SSID)ssj0000269421 035 $a(PQKBManifestationID)11235094 035 $a(PQKBTitleCode)TC0000269421 035 $a(PQKBWorkID)10243049 035 $a(PQKB)11088943 035 $a(MiAaPQ)EBC1679613 035 $a(WSP)00005157 035 $a(Au-PeEL)EBL1679613 035 $a(CaPaEBR)ebr10255991 035 $a(CaONFJC)MIL193444 035 $a(EXLCZ)991000000000537851 100 $a20040212d2003 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aWave processes in solids with microstructure$b[electronic resource] /$fVladimir I. Erofeyev 210 $aSingapore ;$aRiver Edge, NJ $cWorld Scientific$dc2003 215 $a1 online resource (276 p.) 225 0 $aSeries on stability, vibration, and control of systems. Series A ;$vv. 8 300 $aDescription based upon print version of record. 311 $a981-238-227-5 320 $aIncludes bibliographical references (p. 233-252) and index. 327 $aContents ; Preface ; Introduction ; 1. The Fundamental Hypothesis of Microstructured Elastic Solids. Structural-Phenomenological Model ; 1.1 Mathematical Models of Solids with Microstructure ; 1.2 Definition of Material Constants 327 $a2. Gradient Elasticity Media. Dispersion. Dissipation. Non-Linearity 2.1 Dynamic Equations. Energy and Momentum Variation Law ; 2.2 Dispersion Properties of Longitudinal and Shear Waves. Surface Rayleigh Waves ; 2.3 Dissipative Properties ; 2.4 Nonlinear Plain Stationary Waves 327 $a2.5 Quasi-Plain Wave Beams 2.6 Self-Modulation of Quasi-Harmonic Shear Waves ; 2.7 Resonant Interaction of Quasi-Harmonic Waves ; 2.8 Noise Waves ; 3. Gradient Elasticity Media. Damaged Medium. Magnetoelasticity ; 3.1 Waves in Damaged Medium with Microstructure 327 $a3.2 Magneto-Elastic Waves in the Medium with Microstructure 4. Cosserat Continuum ; 4.1 Basic Equations of Micropolar Elasticity Theory ; 4.2 Dispersion Properties of Volume Waves ; 4.3 Wave Reflection from the Free Interface of Micropolar Halfspace. Rayleigh Surface Waves 327 $a4.4 Normal Waves in a Micropolar Layer 4.5 Nonlinear Resonant Interaction of Longitudinal and Rotation Waves ; 4.6 Waves in Cosserat Pseudocontinuum ; 4.7 Waves in the Cosserat Continuum with Symmetric Stress Tensor ; 5. Waves in Two-Component Mixture of Solids 327 $a5.1 Dispersion Properties 330 $a This book systematically discusses the modern theory of propagation and interaction of elastic waves in solids with microstructure. Mathematical models of solids taking into account microstructure, geometrical and physical nonlinearity, damage media, interaction of deformation and magnetic field are obtained. Different wave effects characteristic of solids with microstructure are studied. The opportunity to use these effects in problems of ultrasonic testing of materials and devices of constructions is considered.
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