LEADER 02360nam 2200661 a 450 001 9910461877903321 005 20200520144314.0 010 $a3-11-080649-5 024 7 $a10.1515/9783110806496 035 $a(CKB)2670000000236065 035 $a(EBL)3040517 035 $a(SSID)ssj0000625123 035 $a(PQKBManifestationID)11378096 035 $a(PQKBTitleCode)TC0000625123 035 $a(PQKBWorkID)10596130 035 $a(PQKB)10191357 035 $a(MiAaPQ)EBC3040517 035 $a(WaSeSS)Ind00018079 035 $a(DE-B1597)42776 035 $a(OCoLC)979761405 035 $a(DE-B1597)9783110806496 035 $a(Au-PeEL)EBL3040517 035 $a(CaPaEBR)ebr10588291 035 $a(OCoLC)922943198 035 $a(EXLCZ)992670000000236065 100 $a20790912d1978 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHimalayan anthropology$b[electronic resource] $ethe Indo-Tibetan interface /$feditor, James F. Fisher 205 $aReprint 2011 210 $aThe Hague $cMouton ;$aChicago $cdistributed in the USA and Canada by Aldine$d1978 215 $a1 online resource (583 p.) 225 0 $aWorld Anthropology 225 0$aWorld anthropology 300 $aPapers prepared for the 9th International Congress of Anthropological and Ethnological Sciences, Chicago, 1973. 311 $a90-279-7700-3 320 $aIncludes bibliographical references and indexes. 327 $asection 1. General issues -- section 2. The south Asian perspective -- section 3. The central Asian perspective -- section 4. Perspectives merged : the Newars. 410 0$aWorld Anthropology 606 $aEthnology$zHimalaya Mountains Region$vCongresses 606 $aNewar (Nepalese people)$vCongresses 607 $aHimalaya Mountains Region$xSocial life and customs$vCongresses 608 $aElectronic books. 615 0$aEthnology 615 0$aNewar (Nepalese people) 676 $a301.29/54 701 $aFisher$b James F$090668 712 12$aInternational Congress of Anthropological and Ethnological Sciences$d(9th :$f1973 :$eChicago, Ill.) 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910461877903321 996 $aHimalayan anthropology$92485062 997 $aUNINA LEADER 05558nam 22006854a 450 001 9910830401703321 005 20170814180036.0 010 $a1-280-26970-7 010 $a9786610269709 010 $a0-470-34173-4 010 $a0-470-84619-4 010 $a0-470-85660-2 035 $a(CKB)111087027093250 035 $a(EBL)158119 035 $a(OCoLC)53841747 035 $a(SSID)ssj0000080493 035 $a(PQKBManifestationID)11120467 035 $a(PQKBTitleCode)TC0000080493 035 $a(PQKBWorkID)10095860 035 $a(PQKB)11098498 035 $a(MiAaPQ)EBC158119 035 $a(PPN)177278838 035 $a(EXLCZ)99111087027093250 100 $a20020529d2003 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aRF MEMS and their applications$b[electronic resource] /$fVijay K. Varadan, K. J. Vinoy, K.A. Jose 210 $aWest Sussex, England ;$aHoboken, NJ $cJ. Wiley$dc2003 215 $a1 online resource (408 p.) 300 $aDescription based upon print version of record. 311 $a0-470-84308-X 320 $aIncludes bibliographical references and index. 327 $aRF MEMS and Their Applications; Contents; Preface; 1 Microelectromechanical systems (MEMS) and radio frequency MEMS; 1.1 Introduction; 1.2 MEMS; 1.3 Microfabrications for MEMS; 1.3.1 Bulk micromachining of silicon; 1.3.2 Surface micromachining of silicon; 1.3.3 Wafer bonding for MEMS; 1.3.4 LIGA process; 1.3.5 Micromachining of polymeric MEMS devices; 1.3.6 Three-dimensional microfabrications; 1.4 Electromechanical transducers; 1.4.1 Piezoelectric transducers; 1.4.2 Electrostrictive transducers; 1.4.3 Magnetostrictive transducers; 1.4.4 Electrostatic actuators 327 $a1.4.5 Electromagnetic transducers1.4.6 Electrodynamic transducers; 1.4.7 Electrothermal actuators; 1.4.8 Comparison of electromechanical actuation schemes; 1.5 Microsensing for MEMS; 1.5.1 Piezoresistive sensing; 1.5.2 Capacitive sensing; 1.5.3 Piezoelectric sensing; 1.5.4 Resonant sensing; 1.5.5 Surface acoustic wave sensors; 1.6 Materials for MEMS; 1.6.1 Metal and metal alloys for MEMS; 1.6.2 Polymers for MEMS; 1.6.3 Other materials for MEMS; 1.7 Scope of this book; References; 2 MEMS materials and fabrication techniques; 2.1 Metals; 2.1.1 Evaporation; 2.1.2 Sputtering; 2.2 Semiconductors 327 $a2.2.1 Electrical and chemical properties2.2.2 Growth and deposition; 2.3 Thin films for MEMS and their deposition techniques; 2.3.1 Oxide film formation by thermal oxidation; 2.3.2 Deposition of silicon dioxide and silicon nitride; 2.3.3 Polysilicon film deposition; 2.3.4 Ferroelectric thin films; 2.4 Materials for polymer MEMS; 2.4.1 Classification of polymers; 2.4.2 UV radiation curing; 2.4.3 SU-8 for polymer MEMS; 2.5 Bulk micromachining for silicon-based MEMS; 2.5.1 Isotropic and orientation-dependent wet etching; 2.5.2 Dry etching; 2.5.3 Buried oxide process; 2.5.4 Silicon fusion bonding 327 $a2.5.5 Anodic bonding2.6 Silicon surface micromachining; 2.6.1 Sacrificial layer technology; 2.6.2 Material systems in sacrificial layer technology; 2.6.3 Surface micromachining using plasma etching; 2.6.4 Combined integrated-circuit technology and anisotropic wet etching; 2.7 Microstereolithography for polymer MEMS; 2.7.1 Scanning method; 2.7.2 Two-photon microstereolithography; 2.7.3 Surface micromachining of polymer MEMS; 2.7.4 Projection method; 2.7.5 Polymeric MEMS architecture with silicon, metal and ceramics; 2.7.6 Microstereolithography integrated with thick-film lithography 327 $a2.8 ConclusionsReferences; 3 RF MEMS switches and micro relays; 3.1 Introduction; 3.2 Switch parameters; 3.3 Basics of switching; 3.3.1 Mechanical switches; 3.3.2 Electronic switches; 3.4 Switches for RF and microwave applications; 3.4.1 Mechanical RF switches; 3.4.2 PIN diode RF switches; 3.4.3 Metal oxide semiconductor field effect transistors and monolithic microwave integrated circuits; 3.4.4 RF MEMS switches; 3.4.5 Integration and biasing issues for RF switches; 3.5 Actuation mechanisms for MEMS devices; 3.5.1 Electrostatic switching; 3.5.2 Approaches for low-actuation-voltage switches 327 $a3.5.3 Mercury contact switches 330 $aMicroelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficienc 606 $aRadio circuits$xEquipment and supplies 606 $aMicroelectromechanical systems 606 $aMicrowave circuits 615 0$aRadio circuits$xEquipment and supplies. 615 0$aMicroelectromechanical systems. 615 0$aMicrowave circuits. 676 $a621.3815 676 $a621.38413 700 $aVaradan$b V. K.$f1943-$0719344 701 $aVinoy$b K. J$g(Kalarickaparambil Joseph),$f1969-$01641835 701 $aJose$b K. A$01641836 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910830401703321 996 $aRF MEMS and their applications$93986182 997 $aUNINA