LEADER 05283nam 2200637 a 450 001 9910456393403321 005 20200520144314.0 010 $a1-282-73769-4 010 $a9786612737695 010 $a0-8155-2038-7 010 $a0-08-094658-5 035 $a(CKB)2550000000014100 035 $a(EBL)894706 035 $a(OCoLC)613958939 035 $a(SSID)ssj0000419251 035 $a(PQKBManifestationID)11262218 035 $a(PQKBTitleCode)TC0000419251 035 $a(PQKBWorkID)10401254 035 $a(PQKB)10207354 035 $a(MiAaPQ)EBC894706 035 $a(Au-PeEL)EBL894706 035 $a(CaPaEBR)ebr10408179 035 $a(CaONFJC)MIL273769 035 $a(EXLCZ)992550000000014100 100 $a20100823d2010 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aHandbook of physical vapor deposition (PVD) processing$b[electronic resource] /$fDonald M. Mattox 205 $a2nd ed. 210 $aAmsterdam $cElsevier$d2010 215 $a1 online resource (793 p.) 300 $aDescription based upon print version of record. 311 $a0-8155-2037-9 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Handbook of Physical Vapor Deposition (PVD) Processing; Copyright Page; Contents; Preface to First Edition; Preface to Second Edition; Acknowledgements; Acronyms; Biography; Chapter 1: Introduction; 1.1 Surface Engineering; 1.1.1 Physical Vapor Deposition (PVD) Processes; 1.1.2 Non-PVD Thin Film Atomistic Deposition Processes; 1.1.3 Applications of Vacuum-deposited Materials; 1.2 Thin Film Processing; 1.2.1 Stages of Fabrication; 1.2.2 Factors that Affect Film Properties; 1.2.3 Scale-Up and Manufacturability; 1.3 Process Documentation; 1.3.1 Process Specifications 327 $a1.3.2 Manufacturing Process Instructions (MPIs)1.3.3 Travelers; 1.3.4 Equipment and Calibration Logs; 1.3.5 Commercial/Military Standards and Specifications (Mil Specs); 1.4 Safety and Environmental Concerns; 1.5 Units; 1.5.1 Temperature Scales; 1.5.2 Energy Units; 1.5.3 Prefixes; 1.5.4 The Greek Alphabet; 1.6 Summary; Chapter 2: Substrate (""Real"") Surfaces and Surface Modification; 2.1 Introduction; 2.2 Materials and Fabrication; 2.2.1 Metals; 2.2.2 Ceramics and Glasses; 2.2.3 Polymers; 2.3 Atomic Structure and Atom-particle Interactions; 2.3.1 Atomic Structure and Nomenclature 327 $a2.3.2 Excitation and Atomic Transitions2.3.3 Chemical Bonding; 2.3.4 Probing and Detected Species; 2.4 Characterization of Surfaces and Near-surface Regions; 2.4.1 Elemental (Chemical) Compositional Analysis; 2.4.2 Phase Composition and Microstructure; 2.4.3 Molecular Composition and Chemical Bonding; 2.4.4 Surface Morphology; 2.4.5 Adsorption - Gases and Liquids; 2.4.6 Mechanical and Thermal Properties of Surfaces; 2.4.7 Surface Energy and Surface Tension; 2.4.8 Acidic and Basic Properties of Surfaces; 2.5 Bulk Properties; 2.5.1 Outgassing; 2.5.2 Outdiffusion 327 $a2.6 Modification of Substrate Surfaces2.6.1 Surface Morphology; 2.6.2 Surface Hardness; 2.6.3 Strengthening of Surfaces; 2.6.4 Surface Composition; 2.6.5 Surface ""Activation"" (""Functionalization""); 2.6.6 Surface ""Sensitization""; 2.7 Summary; Chapter 3: The ""Good"" Vacuum (Low Pressure) Processing Environment; 3.1 Introduction; 3.2 Gases and Vapors; 3.2.1 Gas Pressure and Partial Pressure; 3.2.2 Molecular Motion; 3.2.3 Gas Flow; 3.2.4 Ideal Gas Law; 3.2.5 Vapor Pressure and Condensation; 3.3 Gas-surface Interactions; 3.3.1 Residence Time; 3.3.2 Chemical Interactions 327 $a3.4 Vacuum Environment3.4.1 Origin of Gases and Vapors; 3.5 Vacuum Processing Systems; 3.5.1 System Design Considerations and ""Trade-Offs""; 3.5.2 Processing Chamber Configurations; 3.5.3 Equilibrium Conductance; 3.5.4 Pumping Speed and Mass Throughput; 3.5.5 Fixturing and Tooling; 3.5.6 Feedthroughs and Accessories; 3.5.7 Liners and Shields; 3.5.8 Fail-Safe Designs; 3.6 Vacuum pumping; 3.6.1 Mechanical Pumps; 3.6.2 Momentum Transfer Pumps; 3.6.3 Capture Pumps; 3.6.4 Hybrid Pumps; 3.7 Vacuum- and Plasma-Compatible Materials; 3.7.1 Metals; 3.7.2 Ceramic and Glass Materials; 3.7.3 Polymers 327 $a3.8 Assembly 330 $aThis updated version of the popular handbook further explains all aspects of physical vapor deposition (PVD) process technology from the characterizing and preparing the substrate material, through deposition processing and film characterization, to post-deposition processing. The emphasis of the new edition remains on the aspects of the process flow that are critical to economical deposition of films that can meet the required performance specifications, with additional information to support the original material. The book covers subjects seldom treated in the literature: substrate 606 $aPhysical vapor deposition$vHandbooks, manuals, etc 608 $aElectronic books. 615 0$aPhysical vapor deposition 676 $a671.735 700 $aMattox$b D. M$0964240 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910456393403321 996 $aHandbook of physical vapor deposition (PVD) processing$92238624 997 $aUNINA LEADER 00976nam a2200253 i 4500 001 991003615279707536 005 20020503201713.0 008 010104s1967 de ||| | ger 035 $ab10531920-39ule_inst 035 $aEXGIL124011$9ExL 040 $aBiblioteca Interfacoltā$bita 082 0 $a480.09 100 1 $aStrunk, Klaus$0184328 245 10$aNasalpräsentien und Aoriste :$bEin Beitrag zur Morphologie des Verbums im Indo-Iranischen und Griechischen /$cKlaus Strunk 260 $aHeidelberg :$bWinter,$c1967 300 $a143 p. ;$c24 cm. 490 0 $aIndogermanische Bibliothek. 3. Reihe, Untersuchungen 650 4$aFilologia classica 907 $a.b10531920$b21-02-17$c27-06-02 912 $a991003615279707536 945 $aLE002 Ted. IV H 3$g1$iLE002-10201/P6$lle002$o-$pE0.00$q-$rl$s- $t0$u0$v0$w0$x0$y.i10611010$z27-06-02 996 $aNasalpräsentien und Aoriste$9217489 997 $aUNISALENTO 998 $ale002$b01-01-01$cm$da $e-$fger$gde $h0$i1