LEADER 02432nam 2200469 450 001 9910465230003321 005 20200520144314.0 010 $a1-68325-000-1 035 $a(CKB)3710000000727518 035 $a(MiAaPQ)EBC4546442 035 $a(PPN)236461028 035 $a(Au-PeEL)EBL4546442 035 $a(CaPaEBR)ebr11294077 035 $a(OCoLC)962449378 035 $a(EXLCZ)993710000000727518 100 $a20161121h20162016 uy 0 101 0 $aspa 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aCurriculum vitae en Ingles /$fNicoletta Piccardo, Laura Barbasio 210 1$a[Barcelona, Spain] :$cDe Vecchi,$d2016. 210 4$dİ2016 215 $a1 online resource (207 pages) $cillustrations, tables 311 $a84-315-2963-6 330 $aSi nos paramos a analizar la cantidad de cartas y correos electrn?icos profesionales que hay que hacer hoy en da? en ingls? o recapacitamos sobre el n?mero de veces en que hemos rectificado nuestro currc?ulum y nos imaginamos unas lecciones ideadas para que se puedan estudiar en 30 minutos, veremos que aprender o perfeccionar el ingls? es perfectamente posible y est ?al alcance de todos. Este libro le ensea?r ?a redactar correctamente cartas comerciales, correos electrn?icos y un currc?ulum que le abrirn? las puertas al x?ito. Incluye vocabulario y expresiones tc?nicas referentes al mundo laboral, y relativas a distintas r?eas (cargos y profesiones, servicios, habilidades y aptitudes, tr?minos comerciales), un vocabulario imprescindible a la hora de redactar cualquier tipo de escrito en el entorno laboral. Se facilita tambin? un anexo con ejemplos de currc?ulum, cartas y e-mails completos para una mejor comprensin? de lo aprendido. Si dispone de 30 minutos al da? (de camino al trabajo, en la sobremesa) no deje de aprovecharlos para ponerse al da? con un idioma que le abrir ?muchas puertas. 606 $aEmployment interviewing 606 $aCurriculum vitae 608 $aElectronic books. 615 0$aEmployment interviewing. 615 0$aCurriculum vitae. 676 $a650.14 700 $aPiccardo$b Nicoletta$0991022 702 $aBarbasio$b Laura 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910465230003321 996 $aCurriculum vitae en Ingles$92267867 997 $aUNINA LEADER 05310nam 2200673 450 001 9910453398003321 005 20200520144314.0 010 $a1-4557-3109-9 035 $a(CKB)2550000001168309 035 $a(EBL)1575557 035 $a(OCoLC)865333467 035 $a(SSID)ssj0001141544 035 $a(PQKBManifestationID)11750809 035 $a(PQKBTitleCode)TC0001141544 035 $a(PQKBWorkID)11091329 035 $a(PQKB)10605282 035 $a(MiAaPQ)EBC1575557 035 $a(Au-PeEL)EBL1575557 035 $a(CaPaEBR)ebr10816539 035 $a(CaONFJC)MIL549575 035 $a(EXLCZ)992550000001168309 100 $a20131226h20142014 uy| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 00$aHandbook of thermoset plastics /$fedited by Hanna Dodiuk, Sidney H. Goodman 205 $aThird edition. 210 1$aSan Diego :$cWilliam Andrew,$d[2014] 210 4$dİ2014 215 $a1 online resource (795 p.) 225 0$aPDL handbook series 300 $aDescription based upon print version of record. 311 $a1-4557-3107-2 311 $a1-306-18324-3 320 $aIncludes bibliographical references and index. 327 $aFront Cover; Handbook of Thermoset Plastics; Copyright Page; Contents; Preface; Acknowledgments; About the Editors; List of Contributors; 1 Introduction; History; Definitions; Cross-Linking and Curing; Influence of Time, Temperature, and Mass; Shelf Life and Pot Life; Curing; Staging; Cross-Link Density; Measuring Cross-Link Density; Stoichiometric Considerations; Prepolymerization and Adducting; References; Further Reading; 2 Phenol-Formaldehydes; Introduction; Phenolic Resins; Raw Materials; Phenol; Cumene Process for Making Phenol; Raschig Process; Dow Process; Formaldehyde (CH2O) 327 $aHexamethylene Tetramine (Hexamine or "HEXA") (CH2)6N4Resinification (Production) of Phenol-Formaldehyde Resins; Reaction Chemistry; Polymerization Process; Resole Phenolic Resins; Novolak Phenol-Formaldehyde Resins; Differences Between Resole and Novolac Phenolic Resins; Properties of Phenolic Resins; Fillers for Phenolic Resins; Processing Methods for Phenolic Resins; Applications of Phenolic Resins; Phenolic Resins in Plywood; Other Composite Wood Products; Reactivity and Hardening Reactions of PF Wood Adhesive Resins; Phenolic Resins in Adhesive and Bonding Applications 327 $aPhenolic Resins as Insulation MaterialsPhenolic Resins in Friction Materials; Bonded and Coated Abrasives; Phenolic Resins in Foundry and Shell Molding Applications; Shell Molding Process; Cold Box Process; Trends in Foundry and Shell Molding; Phenolic Resins in Laminating Applications; Phenolic Resins in Molding Applications; Phenolic Resins in Coating Applications; Modification of Phenolic Resins; Post-addition of Urea; Co-Condensation Between Phenol and Urea; Addition of Tannins, Lignin, and Isocyanates; Resorcinol Adhesives; Chemistry of RF Resins 327 $aPhenol-Resorcinol- Formaldehyde AdhesivesSpecial Adhesives of Reduced Resorcinol Content; Thermosetting Phenolic Adhesives Based on Natural Resources; References; Further Reading; 3 Polybenzoxazine-new generation phenolics; Introduction; Synthesis of Benzoxazine Monomers (BZ); Ring-Opening Polymerization of Benzoxazines; Regioselectivity and Cross-Linked Structure; Inter/Intramolecular H-Bonding; Kinetics of Thermal Cure; Structure-Property Relationships; Benzoxazines Containing Additional Curable Moieties; Unfunctionalized Polybenzoxazines; Main Chain Polybenzoxazines 327 $aBlends/Composites of PolybenzoxazinesCo-Reactive and Non-Reactive Blends; Fiber and Micro Composites; Nanocomposites of PBZ; Green Chemistry Approaches in PBZ; Click Chemistry in PBZ; Stability and Degradation; Outlook; Acknowledgments; References; 4 Aminos; Introduction; Raw Materials; Urea; Melamine; Chemistry of UF Resins: Urea-Formaldehyde Condensation; Chemistry of MF Resins: Melamine-Formaldehyde Condensation; Mixed Melamine Resins; General Principles of Manufacture and Application; Adhesive and Bonding Resins; Coating Resins; Laminating Resins; Amino Molding Resins 327 $aApplications of Amino Resins 330 $a Thermosetting plastics are a distinct category of plastics whose high performance, durability and reliability at high temperatures makes them suitable for specialty applications ranging from automotive and aerospace through to electronic packaging and consumer products (your melamine kitchen worktop is a thermoset resin!). Recent developments in thermoset plastics technology and processes has broadened their use exponentially over recent years, and these developments continue: in November 2011, French scientists created a new lightweight thermoset that is as strong and stable as previous ma 606 $aThermosetting plastics 608 $aElectronic books. 615 0$aThermosetting plastics. 676 $a668.4 676 $a668.4/22 676 $a668.422 701 $aDodiuk$b Hanna$0877259 701 $aGoodman$b Sidney H$0524427 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910453398003321 996 $aHandbook of thermoset plastics$91958810 997 $aUNINA LEADER 05403nam 2200649Ia 450 001 9910143735403321 005 20170815113039.0 010 $a1-280-73971-1 010 $a9786610739714 010 $a0-470-03263-4 010 $a0-470-03262-6 035 $a(CKB)1000000000357290 035 $a(EBL)284455 035 $a(OCoLC)476034538 035 $a(SSID)ssj0000174678 035 $a(PQKBManifestationID)11181928 035 $a(PQKBTitleCode)TC0000174678 035 $a(PQKBWorkID)10175386 035 $a(PQKB)10533759 035 $a(MiAaPQ)EBC284455 035 $a(PPN)175700664 035 $a(EXLCZ)991000000000357290 100 $a20050624d2006 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aHSDPA/HSUPA for UMTS$b[electronic resource] $ehigh speed radio access for mobile communications /$fedited by Harri Holma and Antti Toskala 210 $aChichester, England ;$aHoboken, NJ $cJohn Wiley$dc2006 215 $a1 online resource (269 p.) 300 $aDescription based upon print version of record. 311 $a0-470-01884-4 320 $aIncludes bibliographical references and index. 327 $aHSDPA/HSUPA for UMTS; Contents; Preface; Acknowledgements; Abbreviations; 1 Introduction; 1.1 WCDMA technology and deployment status; 1.2 HSPA standardization and deployment schedule; 1.3 Radio capability evolution with HSPA; 2 HSPA standardization and background; 2.1 3GPP; 2.1.1 HSDPA standardization in 3GPP; 2.1.2 HSUPA standardization in 3GPP; 2.1.3 Further development of HSUPA and HSDPA; 2.1.4 Beyond HSDPA and HSUPA; 2.2 References; 3 HSPA architecture and protocols; 3.1 Radio resource management architecture; 3.1.1 HSDPA and HSUPA user plane protocol architecture 327 $a3.1.2 Impact of HSDPA and HSUPA on UTRAN interfaces3.1.3 Protocol states with HSDPA and HSUPA; 3.2 References; 4 HSDPA principles; 4.1 HSDPA vs Release 99 DCH; 4.2 Key technologies with HSDPA; 4.2.1 High-speed downlink shared channel; 4.2.2 High-speed shared control channel; 4.3 High-speed dedicated physical control channel; 4.3.1 Fractional DPCH; 4.3.2 HS-DSCH link adaptation; 4.3.3 Mobility; 4.4 BTS measurements for HSDPA operation; 4.5 Terminal capabilities; 4.5.1 L1 and RLC throughputs; 4.5.2 Iub parameters; 4.6 HSDPA MAC layer operation; 4.7 References; 5 HSUPA principles 327 $a5.1 HSUPA vs Release 99 DCH5.2 Key technologies with HSUPA; 5.2.1 Introduction; 5.2.2 Fast L1 HARQ for HSUPA; 5.2.3 Scheduling for HSUPA; 5.3 E-DCH transport channel and physical channels; 5.3.1 Introduction; 5.3.2 E-DCH transport channel processing; 5.3.3 E-DCH dedicated physical data channel; 5.3.4 E-DCH dedicated physical control channel; 5.3.5 E-DCH HARQ indicator channel; 5.3.6 E-DCH relative grant channel; 5.3.7 E-DCH absolute grant channel; 5.3.8 Motivation and impact of two TTI lengths; 5.4 Physical layer procedures; 5.4.1 HARQ; 5.4.2 HARQ and soft handover 327 $a5.4.3 Measurements with HSUPA5.5 MAC layer; 5.5.1 User plane; 5.5.2 MAC-e control message - scheduling information; 5.5.3 Selection of a transport format for E-DCH; 5.5.4 E-DCH coexistence with DCH; 5.5.5 MAC-d flow-specific HARQ parameters; 5.5.6 HSUPA scheduling; 5.5.7 HSUPA scheduling in soft handover; 5.5.8 Advanced HSUPA scheduling; 5.5.9 Non-scheduled transmissions; 5.6 Iub parameters; 5.7 Mobility; 5.7.1 Soft handover; 5.7.2 Compressed mode; 5.8 UE capabilities and data rates; 5.9 References and list of related 3GPP specifications; 6 Radio resource management 327 $a6.1 HSDPA radio resource management6.1.1 RNC algorithms; 6.1.2 Node B algorithms; 6.2 HSUPA radio resource management; 6.2.1 RNC algorithms; 6.2.2 Node B algorithms; 6.3 References; 7 HSDPA bit rates, capacity and coverage; 7.1 General performance factors; 7.1.1 Essential performance metrics; 7.2 Single-user performance; 7.2.1 Basic modulation and coding performance; 7.2.2 HS-DSCH performance; 7.2.3 Impact of QPSK-only UEs in early roll-out; 7.2.4 HS-SCCH performance; 7.2.5 Uplink HS-DPCCH performance; 7.2.6 3GPP test methodology; 7.3 Multiuser system performance; 7.3.1 Simulation methodology 327 $a7.3.2 Multiuser diversity gain 330 $aFrom the editors of the highly successful WCDMA for UMTS, this new book provides a comprehensive and up-to-date reference to High Speed Packet Access (HSPA) technologies for WCDMA. The editors cover both HSDPA and HSUPA, including an in-depth description and explanation of 3GPP standards, and expected performance based on simulations and first measurements. The text also discusses the impact of HSDPA and HSUPA on network dimensioning, covers applications and end-to-end performance in detail, and includes a section on radio frequency requirements and terminal design considerations. The 606 $aMobile communication systems 606 $aVery high speed integrated circuits 606 $aCode division multiple access 615 0$aMobile communication systems. 615 0$aVery high speed integrated circuits. 615 0$aCode division multiple access. 676 $a621.3845 700 $aHolma$b Harri$f1970-$0882875 701 $aToskala$b Antti$028464 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910143735403321 996 $aHSDPA$92255264 997 $aUNINA