LEADER 00771nam0-2200289---450- 001 990008772470403321 005 20160307121415.0 010 $a978-0-7619-4022-7 035 $a000877247 035 $aFED01000877247 035 $a(Aleph)000877247FED01 035 $a000877247 100 $a20081204d2008----km-y0itay50------ba 101 0 $aeng 102 $aUS 105 $a--------001yy 200 1 $a<>management of tourism$fedited by Lesley Pender, Richard Sharpley 210 $aLos Angeles$cSage$d2008 215 $aXXIII, 347 p.$d24 cm 702 1$aPender,$bLesley 702 1$aSharpley,$bRichard 801 0$aIT$bUNINA$gRICA$2UNIMARC 901 $aBK 912 $a990008772470403321 952 $a0-3-353-TI$b9413$fECA 959 $aECA 997 $aUNINA LEADER 03192nam 2200601Ia 450 001 9910449978103321 005 20200520144314.0 010 $a1-280-51439-6 010 $a9786610514397 010 $a1-84544-175-3 035 $a(CKB)1000000000007685 035 $a(EBL)289878 035 $a(OCoLC)70746454 035 $a(SSID)ssj0000474661 035 $a(PQKBManifestationID)11315366 035 $a(PQKBTitleCode)TC0000474661 035 $a(PQKBWorkID)10455539 035 $a(PQKB)11745204 035 $a(MiAaPQ)EBC289878 035 $a(Au-PeEL)EBL289878 035 $a(CaPaEBR)ebr10064573 035 $a(CaONFJC)MIL51439 035 $a(EXLCZ)991000000000007685 100 $a20040205d2004 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 00$aSubstrate technology$b[electronic resource] 210 $aBradford, England $cEmerald Group$d2004 215 $a1 online resource (86 p.) 225 1 $aCircuit World. No. 4 ;$vVol. 30 300 $aDescription based upon print version of record. 311 $a1-84544-011-0 327 $aContents; English - Abstracts & keywords; French - Abstracts & keywords; German - Abstracts & keywords; Contributors; Editorial; High frequency PCB base materials - a comparison of thermomechanical properties; High performance epoxy copper clad laminate; High-performance substrate from new epoxy resin and enhanced copper foil; An innovative "Chemical Via" process for the production of high density interconnect printed circuit boards; An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication 327 $aA novel method for sequentially-building multi-layer circuits using LCP laminates, cap-layers and bond plysPCB drillability: a material science approach to resin development; What share of the global upturn can Europe retain?; Internet commentary; Book reviews; Intellect commentary; Company profile; Association news; New products; Industry news; Exhibitions and conferences; Appointments; International diary 330 $aThere is increasing customer demand for materials with low dissipation factors for reduced loss along the traces and low dielectric constants for higher signal propagation speeds. High performance epoxies such as Nelco's N4000- 13, Isola's FR408 and General Electric's GETEK (similar to Matsushita's MEGTRON) have become essential for boards operating in the higher frequency range. For applications at the highest frequencies material choices are very limited. These materials, tailored for high frequency use, have disadvantages - either with their thermomechanical properties or with their process 410 0$aCircuit World.$nNo. 4 ;$vv. 30. 606 $aElectronic circuits 606 $aMaterials science 608 $aElectronic books. 615 0$aElectronic circuits. 615 0$aMaterials science. 676 $a621.319 676 $a621.3192 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910449978103321 996 $aSubstrate technology$92267355 997 $aUNINA