LEADER 04083nam 22007695 450 001 9910437817503321 005 20200630194721.0 010 $a3-642-37614-2 024 7 $a10.1007/978-3-642-37614-6 035 $a(CKB)2670000000406827 035 $a(EBL)1398765 035 $a(SSID)ssj0000960640 035 $a(PQKBManifestationID)11572937 035 $a(PQKBTitleCode)TC0000960640 035 $a(PQKBWorkID)10960363 035 $a(PQKB)10385717 035 $a(DE-He213)978-3-642-37614-6 035 $a(MiAaPQ)EBC1398765 035 $a(PPN)172426413 035 $a(EXLCZ)992670000000406827 100 $a20130716d2013 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aDesign of Adhesive Joints Under Humid Conditions$b[electronic resource] /$fedited by Lucas F. M. da Silva, Chiaki Sato 205 $a1st ed. 2013. 210 1$aBerlin, Heidelberg :$cSpringer Berlin Heidelberg :$cImprint: Springer,$d2013. 215 $a1 online resource (185 p.) 225 1 $aAdvanced Structured Materials,$x1869-8433 ;$v25 300 $aDescription based upon print version of record. 311 $a3-642-44665-5 311 $a3-642-37613-4 320 $aIncludes bibliographical references. 327 $aDiffusion of moisture in adhesives -- Diffusion of moisture in interfaces -- Surface treatments for moisture resistance -- Influence of moisture on the adhesive properties -- Influence of water on the interface properties -- Prediction of joint strength under humid conditions: Continuum mechanics approach -- Prediction of joint strength under humid conditions: Fracture mechanics approach -- Prediction of joint strength under humid conditions: Damage mechanics approach. 330 $aThis book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It  presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted. 410 0$aAdvanced Structured Materials,$x1869-8433 ;$v25 606 $aMaterials?Surfaces 606 $aThin films 606 $aMechanics 606 $aMechanics, Applied 606 $aPolymers   606 $aAerospace engineering 606 $aAstronautics 606 $aSurfaces and Interfaces, Thin Films$3https://scigraph.springernature.com/ontologies/product-market-codes/Z19000 606 $aSolid Mechanics$3https://scigraph.springernature.com/ontologies/product-market-codes/T15010 606 $aPolymer Sciences$3https://scigraph.springernature.com/ontologies/product-market-codes/C22008 606 $aAerospace Technology and Astronautics$3https://scigraph.springernature.com/ontologies/product-market-codes/T17050 615 0$aMaterials?Surfaces. 615 0$aThin films. 615 0$aMechanics. 615 0$aMechanics, Applied. 615 0$aPolymers  . 615 0$aAerospace engineering. 615 0$aAstronautics. 615 14$aSurfaces and Interfaces, Thin Films. 615 24$aSolid Mechanics. 615 24$aPolymer Sciences. 615 24$aAerospace Technology and Astronautics. 676 $a660.293 702 $ada Silva$b Lucas F. M$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aSato$b Chiaki$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910437817503321 996 $aDesign of Adhesive Joints Under Humid Conditions$92496952 997 $aUNINA