LEADER 02040nam 2200565Ia 450 001 9910700760803321 005 20260430110050.0 035 $a(CKB)5470000002411398 035 $a(OCoLC)747568690 035 $a(DGPO)000826811 035 $a(EXLCZ)995470000002411398 100 $a20110823d2011 ua 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aComparison of open-hole compression strength and compression after impact strength on carbon fiber/epoxy laminates for the Ares I composite interstage /$fA.J. Hodge, A.T. Nettles, and J.R. Jackson 210 1$a[Huntsville], Ala. :$cNational Aeronautics and Space Administration, Marshall Space Flight Center,$d[2011] 215 $a1 online resource (viii, 23 pages) $cillustrations (some color) 225 1 $aNASA/TP ;$v2011-216460 300 $aTitle from title screen (viewed on Aug. 22, 2011). 300 $a"March 2011." 320 $aIncludes bibliographical references (pages 22-23). 606 $aCompressive strength$2nasat 606 $aSandwich structures$2nasat 606 $aCarbon fibers$2nasat 606 $aImpact strength$2nasat 606 $aDamage$2nasat 606 $aEpoxy matrix composites$2nasat 606 $aLaminates$2nasat 606 $aFiber composites$2nasat 615 7$aCompressive strength. 615 7$aSandwich structures. 615 7$aCarbon fibers. 615 7$aImpact strength. 615 7$aDamage. 615 7$aEpoxy matrix composites. 615 7$aLaminates. 615 7$aFiber composites. 700 $aHodge$b A. J$01403595 701 $aNettles$b A. T$g(Alan T.)$01389578 701 $aJackson$b J. R$01403596 712 02$aGeorge C. Marshall Space Flight Center. 801 0$bGPO 801 1$bGPO 906 $aBOOK 912 $a9910700760803321 996 $aComparison of open-hole compression strength and compression after impact strength on carbon fiber$93498703 997 $aUNINA LEADER 05087nam 2201141z- 450 001 9910404081403321 005 20210211 010 $a3-03928-974-8 035 $a(CKB)4100000011302324 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/50428 035 $a(oapen)doab50428 035 $a(oapen)50428 035 $a(EXLCZ)994100000011302324 100 $a20202102d2020 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aIntelligent Electronic Devices 210 $cMDPI - Multidisciplinary Digital Publishing Institute$d2020 215 $a1 online resource (220 p.) 311 08$a3-03928-973-X 330 $aIn a modern technological society, electronic engineering and design innovations are both academic and practical engineering fields that involve systematic technological materialization through scientific principles and engineering designs. Engineers and designers must work together with a variety of other professionals in their quest to find systems solutions to complex problems. Rapid advances in science and technology have broadened the horizons of engineering while simultaneously creating a multitude of challenging problems in every aspect of modern life. Current research is interdisciplinary in nature, reflecting a combination of concepts and methods that often span several areas of mechanics, mathematics, electrical engineering, control engineering, and other scientific disciplines. In addition, the 2nd IEEE International Conference on Knowledge Innovation and Invention 2019 (IEEE ICKII 2019) was held in Seoul, South Korea, on 12-15 July, 2019. This book, "Intelligent Electronic Devices", includes 13 excellent papers form 260 papers presented in this conference about intelligent electronic devices. The main goals of this book were to encourage scientists to publish their experimental and theoretical results in as much detail as possible and to provide new scientific knowledge relevant to the topics of electronics. 606 $aHistory of engineering and technology$2bicssc 610 $a180-degree conduction 610 $a6-DOF robot arm 610 $aaction quality assessment 610 $aactuator 610 $aadaptive network-based fuzzy inference system (ANFIS) 610 $aAedes aegypti 610 $aAedes albopictus 610 $aas low as diagnostically acceptable (ALADA) 610 $abroadcast circuit 610 $abrushless DC motor 610 $abuilt-in self-test 610 $acommunications and information processing 610 $acomputer science and engineering 610 $acone-beam computerized tomography (CBCT) 610 $acurrent-voltage characteristics 610 $adiagnostic ability 610 $adrift region 610 $adual-input converter 610 $aelectrical circuits and devices 610 $aelectromagnetic interference 610 $aelectromagnetic lock 610 $aelectrostatic discharge (ESD) 610 $aEu3+ and In3+ ions 610 $agalvanic isolation 610 $ahigh voltage gain 610 $ahigh-definition multimedia interface 610 $aholding voltage (Vh) 610 $ahuman activity analysis 610 $ahydrothermal method 610 $alaser pointer 610 $alatchup (LU) 610 $alateral diffusion MOS (LDMOS) 610 $aleakage energy recycling 610 $alow cost 610 $alow-dosed 610 $alower limb exoskeleton 610 $amosquitoes 610 $amulti-robots 610 $amultiple simple current mirror 610 $an-channel lateral diffused MOSFET (nLDMOS) 610 $anegative differential resistance 610 $anon-uniform conduction 610 $aoscillator 610 $apath programming 610 $aPCB layout 610 $aphotoluminescence properties 610 $aradiation resistance 610 $aregions with convolutional neural network (R-CNN) 610 $asecondary breakdown current (It2) 610 $asecondary freeform lens device (SFLD) 610 $aselective anatomy analytic iteration reconstruction (SA2IR) 610 $asensorless motor drive 610 $askeletal feature representation 610 $asound recognition module 610 $asparse projections 610 $aspeed control 610 $astearic 610 $atabu search 610 $atest pattern generation 610 $athreshold voltage 610 $atransmission-line pulse system (TLP system) 610 $avoltage clamping 610 $avoltage-controlled oscillator 610 $awearable robot 610 $aZnO-based nanowires 615 7$aHistory of engineering and technology 700 $aZhao$b Wenbing$4auth$0960425 702 $aYang$b Zhengfu$c(Writer on computers)$4auth 702 $aMeen$b Teen-­Hang$4auth 906 $aBOOK 912 $a9910404081403321 996 $aIntelligent Electronic Devices$93031032 997 $aUNINA