LEADER 04578nam 22007455 450 001 9910373933503321 005 20200705025842.0 010 $a981-15-0943-3 024 7 $a10.1007/978-981-15-0943-8 035 $a(CKB)4100000009844990 035 $a(DE-He213)978-981-15-0943-8 035 $a(MiAaPQ)EBC5982491 035 $a(PPN)258303751 035 $a(EXLCZ)994100000009844990 100 $a20191120d2019 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aLaser Heat-Mode Lithography $ePrinciple and Methods /$fby Jingsong Wei 205 $a1st ed. 2019. 210 1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d2019. 215 $a1 online resource (XIII, 208 p. 182 illus., 160 illus. in color.) 225 1 $aSpringer Series in Materials Science,$x0933-033X ;$v291 311 $a981-15-0942-5 320 $aIncludes bibliographical references. 327 $aCurrent status of lithography -- Principles of laser heat-mode lithography and thermal diffusion -- Laser heat-mode maskless lithography system -- Manipulation of thermal diffusion channels -- Laser heat-mode nanolithography on phase-change thin films -- Direct laser heat-mode nanopatterning on metallo-organic compound thin films -- Laser heat-mode patterning of transparent thin films -- Laser heat-mode grayscale image lithography -- Patterns transfer processes and applications. 330 $aThis book provides a systematic description and analysis of laser heat-mode lithography, addressing the basic principles, lithography system, manipulation of feature size, grayscale lithography, resist thin films, and pattern transfer, while also presenting typical experimental results and applications. It introduces laser heat-mode lithography, where the resist thin films are essentially an opto-thermal response to the laser beam with changeable wavelength and are not sensitive to laser wavelength. Laser heat-mode lithography techniques greatly simplify production procedures because they require neither a particular light source nor a particular environment; further, there are no pre-baking and post-baking steps required for organic photoresists. The pattern feature size can be either larger or smaller than the laser spot by adjusting the writing strategy. The lithographic feature size can also be arbitrarily tuned from nanoscale to micrometer without changing the laser spot size. Lastly, the line edge roughness can be controlled at a very low value because the etching process is a process of breaking bonds among atoms. The book offers an invaluable reference guide for all advanced undergraduates, graduate students, researchers and engineers working in the fields of nanofabrication, lithography techniques and systems, phase change materials, etc. 410 0$aSpringer Series in Materials Science,$x0933-033X ;$v291 606 $aSurfaces (Physics) 606 $aInterfaces (Physical sciences) 606 $aThin films 606 $aLasers 606 $aPhotonics 606 $aMicrowaves 606 $aOptical engineering 606 $aOptical materials 606 $aElectronic materials 606 $aSurface and Interface Science, Thin Films$3https://scigraph.springernature.com/ontologies/product-market-codes/P25160 606 $aOptics, Lasers, Photonics, Optical Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31030 606 $aMicrowaves, RF and Optical Engineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T24019 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 615 0$aSurfaces (Physics). 615 0$aInterfaces (Physical sciences). 615 0$aThin films. 615 0$aLasers. 615 0$aPhotonics. 615 0$aMicrowaves. 615 0$aOptical engineering. 615 0$aOptical materials. 615 0$aElectronic materials. 615 14$aSurface and Interface Science, Thin Films. 615 24$aOptics, Lasers, Photonics, Optical Devices. 615 24$aMicrowaves, RF and Optical Engineering. 615 24$aOptical and Electronic Materials. 676 $a530.417 700 $aWei$b Jingsong$4aut$4http://id.loc.gov/vocabulary/relators/aut$0792199 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910373933503321 996 $aLaser Heat-Mode Lithography$92527167 997 $aUNINA