LEADER 04375nam 2200937z- 450 001 9910367745603321 005 20231214133003.0 010 $a3-03921-737-2 035 $a(CKB)4100000010106261 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/60867 035 $a(EXLCZ)994100000010106261 100 $a20202102d2019 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aThermal and Electro-thermal System Simulation 210 $cMDPI - Multidisciplinary Digital Publishing Institute$d2019 215 $a1 electronic resource (222 p.) 311 $a3-03921-736-4 330 $aWith increasing power levels and power densities in electronics systems, thermal issues are becoming more and more critical. The elevated temperatures result in changing electrical system parameters, changing the operation of devices, and sometimes even the destruction of devices. To prevent this, the thermal behavior has to be considered in the design phase. This can be done with thermal end electro-thermal design and simulation tools. This Special Issue of Energies, edited by two well-known experts of the field, Prof. Marta Rencz, Budapest University of Technology and Economics, and by Prof. Lorenzo Codecasa, Politecnico di Milano, collects twelve papers carefully selected for the representation of the latest results in thermal and electro-thermal system simulation. These contributions present a good survey of the latest results in one of the most topical areas in the field of electronics: The thermal and electro-thermal simulation of electronic components and systems. Several papers of this issue are extended versions of papers presented at the THERMINIC 2018 Workshop, held in Stockholm in the fall of 2018. The papers presented here deal with modeling and simulation of state-of-the-art applications that are highly critical from the thermal point of view, and around which there is great research activity in both industry and academia. Contributions covered the thermal simulation of electronic packages, electro-thermal advanced modeling in power electronics, multi-physics modeling and simulation of LEDs, and the characterization of interface materials, among other subjects. 610 $athermal interface material 610 $athermal aging 610 $amodeling 610 $aLED compact thermal models 610 $aniobium pentoxide 610 $amodel-order reduction 610 $aferromagnetic cores 610 $aLED digital twin 610 $aCauer RC ladder 610 $ain-situ characterization 610 $aelectronic packages 610 $atime domain thermoreflectance 610 $amulti-domain compact model 610 $apower LEDs 610 $aDC?DC converters 610 $astructure function 610 $aboundary condition independent 610 $aelectric aircraft 610 $amulti-LED 610 $amodelling 610 $alight emitting diodes 610 $athin film 610 $aJEDEC metrics 610 $atool agnostic 610 $apower losses 610 $aswitching 610 $adynamic thermal compact model 610 $athermal transient testing 610 $areliability 610 $athermal transient analysis 610 $athermal simulation 610 $anon-destructive testing 610 $aIGBT 610 $acarbon nanotubes 610 $acompact thermal model 610 $apower semiconductor devices 610 $aSPICE 610 $aphosphor light conversion 610 $athermal management 610 $aLED luminaire design 610 $adesign flow 610 $athermal characterization 610 $amotor cooling 610 $athermal phenomena 610 $asilicone dome 610 $aLED 610 $asecondary heat path 610 $amulti-domain modelling 610 $aheating and optical power 610 $atransient analysis 610 $athermal testability 610 $athermal conductivity 610 $amultiple heat source 700 $aCodecasa$b Lorenzo$4auth$01302960 702 $aRencz$b Márta$4auth 906 $aBOOK 912 $a9910367745603321 996 $aThermal and Electro-thermal System Simulation$93026774 997 $aUNINA