LEADER 04016nam 22006735 450 001 9910366594203321 005 20200706041946.0 010 $a3-030-20776-5 024 7 $a10.1007/978-3-030-20776-2 035 $a(CKB)4100000008618249 035 $a(MiAaPQ)EBC5813796 035 $a(DE-He213)978-3-030-20776-2 035 $a(PPN)238489914 035 $a(EXLCZ)994100000008618249 100 $a20190708d2020 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aInsert Devices and Integral Roughness in Heat Transfer Enhancement$b[electronic resource] /$fby Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti 205 $a1st ed. 2020. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2020. 215 $a1 online resource (180 pages) 225 1 $aSpringerBriefs in Thermal Engineering and Applied Science,$x2193-2530 311 $a3-030-20775-7 320 $aIncludes bibliographical references and index. 327 $aChapter 1. Introduction -- Chapter 2. Twisted-Tape Insert -- Chapter 3. Displaced Enhancement Devices and Wire Coil Inserts -- Chapter 4. Swirl Generators, Extended Surface Insert and Tangential Injection Devices -- Chapter 5. Numerical Simulation of Integral Roughness, Laminar Flow in Tubes with Roughness -- Chapter 6. 2D Roughness, 3D roughness and Roughness Applications -- Chapter 7. Compound Techniques -- Chapter 8. Conclusions. 330 $aThis Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices. . 410 0$aSpringerBriefs in Thermal Engineering and Applied Science,$x2193-2530 606 $aThermodynamics 606 $aHeat engineering 606 $aHeat transfer 606 $aMass transfer 606 $aFluid mechanics 606 $aMaterials science 606 $aEngineering Thermodynamics, Heat and Mass Transfer$3https://scigraph.springernature.com/ontologies/product-market-codes/T14000 606 $aThermodynamics$3https://scigraph.springernature.com/ontologies/product-market-codes/P21050 606 $aEngineering Fluid Dynamics$3https://scigraph.springernature.com/ontologies/product-market-codes/T15044 606 $aCharacterization and Evaluation of Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z17000 615 0$aThermodynamics. 615 0$aHeat engineering. 615 0$aHeat transfer. 615 0$aMass transfer. 615 0$aFluid mechanics. 615 0$aMaterials science. 615 14$aEngineering Thermodynamics, Heat and Mass Transfer. 615 24$aThermodynamics. 615 24$aEngineering Fluid Dynamics. 615 24$aCharacterization and Evaluation of Materials. 676 $a621.4022 700 $aSaha$b Sujoy Kumar$4aut$4http://id.loc.gov/vocabulary/relators/aut$0720750 702 $aRanjan$b Hrishiraj$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aEmani$b Madhu Sruthi$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aBharti$b Anand Kumar$4aut$4http://id.loc.gov/vocabulary/relators/aut 906 $aBOOK 912 $a9910366594203321 996 $aInsert Devices and Integral Roughness in Heat Transfer Enhancement$92527187 997 $aUNINA