LEADER 04190nam  22005655  450 
001 9910366578603321
005 20200706051621.0
010   $a3-030-25201-9
024 7 $a10.1007/978-3-030-25201-4
035   $a(CKB)4100000009160263
035   $a(DE-He213)978-3-030-25201-4
035   $a(MiAaPQ)EBC5890657
035   $a(EXLCZ)994100000009160263
100   $a20190903d2020      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aAdvanced Thermal Stress Analysis of Smart Materials and Structures /$fby Zengtao Chen, Abdolhamid Akbarzadeh
205   $a1st ed. 2020.
210  1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2020.
215   $a1 online resource (X, 304 p. 104 illus., 44 illus. in color.) 
225 1 $aStructural Integrity,$x2522-560X ;$v10
311   $a3-030-25200-0 
327   $aHeat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.
330   $aThis is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials. .
410  0$aStructural Integrity,$x2522-560X ;$v10
606   $aMechanics
606   $aMechanics, Applied
606   $aMaterials science
606   $aMathematical models
606   $aSolid Mechanics$3https://scigraph.springernature.com/ontologies/product-market-codes/T15010
606   $aCharacterization and Evaluation of Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z17000
606   $aMathematical Modeling and Industrial Mathematics$3https://scigraph.springernature.com/ontologies/product-market-codes/M14068
615  0$aMechanics.
615  0$aMechanics, Applied.
615  0$aMaterials science.
615  0$aMathematical models.
615 14$aSolid Mechanics.
615 24$aCharacterization and Evaluation of Materials.
615 24$aMathematical Modeling and Industrial Mathematics.
676   $a531
676   $a620.11296
700   $aChen$b Zengtao$4aut$4http://id.loc.gov/vocabulary/relators/aut$01060632
702   $aAkbarzadeh$b Abdolhamid$4aut$4http://id.loc.gov/vocabulary/relators/aut
906   $aBOOK
912   $a9910366578603321
996   $aAdvanced Thermal Stress Analysis of Smart Materials and Structures$92514696
997   $aUNINA