LEADER 03575nam 22006975 450 001 9910350301703321 005 20200629231200.0 010 $a981-13-3627-X 024 7 $a10.1007/978-981-13-3627-0 035 $a(CKB)4100000008525770 035 $a(DE-He213)978-981-13-3627-0 035 $a(MiAaPQ)EBC5759460 035 $a(PPN)235666920 035 $a(EXLCZ)994100000008525770 100 $a20190423d2019 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aModeling and Application of Flexible Electronics Packaging /$fby YongAn Huang, Zhouping Yin, Xiaodong Wan 205 $a1st ed. 2019. 210 1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d2019. 215 $a1 online resource (XVII, 287 p.) 311 $a981-13-3626-1 327 $aAdvanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. 330 $aThis book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. 606 $aElectronics 606 $aMicroelectronics 606 $aOptical materials 606 $aElectronic materials 606 $aManufactures 606 $aMechanics 606 $aMechanics, Applied 606 $aComputer simulation 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 606 $aManufacturing, Machines, Tools, Processes$3https://scigraph.springernature.com/ontologies/product-market-codes/T22050 606 $aTheoretical and Applied Mechanics$3https://scigraph.springernature.com/ontologies/product-market-codes/T15001 606 $aSimulation and Modeling$3https://scigraph.springernature.com/ontologies/product-market-codes/I19000 615 0$aElectronics. 615 0$aMicroelectronics. 615 0$aOptical materials. 615 0$aElectronic materials. 615 0$aManufactures. 615 0$aMechanics. 615 0$aMechanics, Applied. 615 0$aComputer simulation. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aOptical and Electronic Materials. 615 24$aManufacturing, Machines, Tools, Processes. 615 24$aTheoretical and Applied Mechanics. 615 24$aSimulation and Modeling. 676 $a621.381 700 $aHuang$b YongAn$4aut$4http://id.loc.gov/vocabulary/relators/aut$0941414 702 $aYin$b Zhouping$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aWan$b Xiaodong$4aut$4http://id.loc.gov/vocabulary/relators/aut 906 $aBOOK 912 $a9910350301703321 996 $aModeling and Application of Flexible Electronics Packaging$92123445 997 $aUNINA