LEADER 03575nam  22006975  450 
001 9910350301703321
005 20200629231200.0
010   $a981-13-3627-X
024 7 $a10.1007/978-981-13-3627-0
035   $a(CKB)4100000008525770
035   $a(DE-He213)978-981-13-3627-0
035   $a(MiAaPQ)EBC5759460
035   $a(PPN)235666920
035   $a(EXLCZ)994100000008525770
100   $a20190423d2019      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aModeling and Application of Flexible Electronics Packaging /$fby YongAn Huang, Zhouping Yin, Xiaodong Wan
205   $a1st ed. 2019.
210  1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d2019.
215   $a1 online resource (XVII, 287 p.) 
311   $a981-13-3626-1 
327   $aAdvanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
330   $aThis book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
606   $aElectronics
606   $aMicroelectronics
606   $aOptical materials
606   $aElectronic materials
606   $aManufactures
606   $aMechanics
606   $aMechanics, Applied
606   $aComputer simulation
606   $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027
606   $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000
606   $aManufacturing, Machines, Tools, Processes$3https://scigraph.springernature.com/ontologies/product-market-codes/T22050
606   $aTheoretical and Applied Mechanics$3https://scigraph.springernature.com/ontologies/product-market-codes/T15001
606   $aSimulation and Modeling$3https://scigraph.springernature.com/ontologies/product-market-codes/I19000
615  0$aElectronics.
615  0$aMicroelectronics.
615  0$aOptical materials.
615  0$aElectronic materials.
615  0$aManufactures.
615  0$aMechanics.
615  0$aMechanics, Applied.
615  0$aComputer simulation.
615 14$aElectronics and Microelectronics, Instrumentation.
615 24$aOptical and Electronic Materials.
615 24$aManufacturing, Machines, Tools, Processes.
615 24$aTheoretical and Applied Mechanics.
615 24$aSimulation and Modeling.
676   $a621.381
700   $aHuang$b YongAn$4aut$4http://id.loc.gov/vocabulary/relators/aut$0941414
702   $aYin$b Zhouping$4aut$4http://id.loc.gov/vocabulary/relators/aut
702   $aWan$b Xiaodong$4aut$4http://id.loc.gov/vocabulary/relators/aut
906   $aBOOK
912   $a9910350301703321
996   $aModeling and Application of Flexible Electronics Packaging$92123445
997   $aUNINA