LEADER 03449nam  22005295  450 
001 9910350298303321
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010   $a981-13-7224-1
024 7 $a10.1007/978-981-13-7224-7
035   $a(CKB)4100000008525920
035   $a(DE-He213)978-981-13-7224-7
035   $a(MiAaPQ)EBC5746944
035   $a(PPN)235667218
035   $a(EXLCZ)994100000008525920
100   $a20190403d2019      u|             0
101 0 $aeng
135   $aurnn#008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aHeterogeneous integrations /$fby John H. Lau
205   $a1st ed. 2019.
210  1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d[2019].
215   $a1 online resource (XXII, 368 p. 386 illus., 342 illus. in color.)
311   $a981-13-7223-3 
327   $aChapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
330   $aHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
606   $aIntegrated circuits
606   $aElectronics
606   $aMicroelectronics
606   $aElectronic circuits
606   $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027
606   $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068
606   $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010
615  0$aIntegrated circuits.
615  0$aElectronics.
615  0$aMicroelectronics.
615  0$aElectronic circuits.
615 14$aElectronics and Microelectronics, Instrumentation.
615 24$aCircuits and Systems.
615 24$aElectronic Circuits and Devices.
676   $a621.381
700   $aLau$b John H.$4aut$4http://id.loc.gov/vocabulary/relators/aut$0972648
906   $aBOOK
912   $a9910350298303321
996   $aHeterogeneous Integrations$92228299
997   $aUNINA