LEADER 05053nam 2201177z- 450 001 9910346853503321 005 20231214133229.0 010 $a3-03897-415-3 035 $a(CKB)4920000000095132 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/53145 035 $a(EXLCZ)994920000000095132 100 $a20202102d2019 |y 0 101 0 $aeng 135 $aurmn|---annan 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aMEMS Accelerometers 210 $cMDPI - Multidisciplinary Digital Publishing Institute$d2019 215 $a1 electronic resource (252 p.) 311 $a3-03897-414-5 330 $aMicro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. 610 $amicromachining 610 $aturbulent kinetic energy dissipation rate 610 $amicroelectromechanical systems (MEMS) piezoresistive sensor chip 610 $aWiFi-RSSI radio map 610 $astep detection 610 $abuilt-in self-test 610 $aregularity of activity 610 $amotion analysis 610 $agait analysis 610 $afrequency 610 $aacceleration 610 $aMEMS accelerometer 610 $azero-velocity update 610 $arehabilitation assessment 610 $avacuum microelectronic 610 $adance classification 610 $aKerr noise 610 $aMEMS 610 $amicro machining 610 $aMEMS sensors 610 $astereo visual-inertial odometry 610 $aself-coaching 610 $aminiaturization 610 $awavelet packet 610 $athree-axis acceleration sensor 610 $aMEMS-IMU accelerometer 610 $aperformance characterization 610 $aelectrostatic stiffness 610 $adelaying mechanism 610 $athree-axis accelerometer 610 $aangular-rate sensing 610 $aindoor positioning 610 $awhispering-gallery-mode 610 $asensitivity 610 $aheat convection 610 $amulti-axis sensing 610 $aL-shaped beam 610 $astride length estimation 610 $aactivity monitoring 610 $aprocess optimization 610 $amismatch of parasitic capacitance 610 $aelectromechanical delta-sigma 610 $acathode tips array 610 $ain situ self-testing 610 $ahigh acceleration sensor 610 $adeep learning 610 $amarine environmental monitoring 610 $aaccelerometer 610 $afault tolerant 610 $ahostile environment 610 $amicro-electro-mechanical systems (MEMS) 610 $alow-temperature co-fired ceramic (LTCC) 610 $aclassification of horse gaits 610 $aTaguchi method 610 $ainterface ASIC 610 $acapacitive transduction 610 $adigital resonator 610 $asafety and arming system 610 $ainertial sensors 610 $aMEMS technology 610 $asleep time duration detection 610 $afield emission 610 $aprobe 610 $apiezoresistive effect 610 $acapacitive accelerometer 610 $aauto-encoder 610 $aMEMS-IMU 610 $abody sensor network 610 $aoptical microresonator 610 $awireless 610 $ahybrid integrated 610 $amode splitting 700 $aNgo$b Ha Duong$4auth$01329322 702 $aRasras$b Mahmoud$4auth 702 $aElfadel$b Ibrahim (Abe) M$4auth 906 $aBOOK 912 $a9910346853503321 996 $aMEMS Accelerometers$93039424 997 $aUNINA