LEADER 01772nam  2200385z- 450 
001 9910346703003321
005 20210211
010   $a1000034759
035   $a(CKB)4920000000094664
035   $a(oapen)https://directory.doabooks.org/handle/20.500.12854/49267
035   $a(oapen)doab49267
035   $a(EXLCZ)994920000000094664
100   $a20202102d2013      |y         0
101 0 $aeng
135   $aurmn|---annan
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aHigh Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method
210   $cKIT Scientific Publishing$d2013
215   $a1 online resource (XII, 140 p. p.)
225 1 $aSchriftenreihe des Instituts für Angewandte Materialien, Karlsruher Institut für Technologie
311 08$a3-7315-0025-6 
330   $aIn the last two decades, the reliability of small electronic devices used in automotive or consumer electronics gained researchers attention. Thus, there is the need to understand the fatigue properties and damage mechanisms of thin films. In this thesis a novel high-throughput testing method for thin films on Si substrate is presented. The specialty of this method is to test one sample at different strain amplitudes at the same time and measure an entire lifetime curve with only one experiment.
606   $aTechnology: general issues$2bicssc
610   $acantilever bending
610   $adamage structure
610   $aFatigue
610   $athin film
615  7$aTechnology: general issues
700   $aBurger$b Sofie$4auth$01302194
906   $aBOOK
912   $a9910346703003321
996   $aHigh Cycle Fatigue of Al and Cu Thin Films by a Novel High-Throughput Method$93026232
997   $aUNINA