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011   $a1555-8037
035   $a(CKB)1000000000210660
035   $a(CONSER)--2004242075
035   $a(DE-599)ZDB2632004-6
035   $a(EXLCZ)991000000000210660
100   $a20040408a20049999  ---         a
101 0 $aeng
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 00$aJournal of microelectronics and electronic packaging
210   $aWashington, DC $cInternational Microelectronics and Packaging Society$d2004-
215   $a1 online resource
300   $a"A publication of the International Microelectronics and Packaging Society."
300   $aRefereed/Peer-reviewed
311   $aPrint version: Journal of microelectronics and electronic packaging. (DLC)  2004242075 (OCoLC)54911527 1551-4897 
606   $aMicroelectronics$vPeriodicals
606   $aElectronic packaging$vPeriodicals
606   $aMicroelectronic packaging$vPeriodicals
606   $aElectronic packaging$2fast$3(OCoLC)fst00907414
606   $aMicroelectronic packaging$2fast$3(OCoLC)fst01019751
606   $aMicroelectronics$2fast$3(OCoLC)fst01019757
608   $aPeriodicals.$2fast
615  0$aMicroelectronics
615  0$aElectronic packaging
615  0$aMicroelectronic packaging
615  7$aElectronic packaging.
615  7$aMicroelectronic packaging.
615  7$aMicroelectronics.
676   $a621.381/046/05
712 02$aInternational Microelectronics and Packaging Society.
906   $aJOURNAL
912   $a9910338748403321
920   $aexl_impl conversion
996   $aJournal of microelectronics and electronic packaging$92039295
997   $aUNINA