LEADER 01409nam  2200361   450 
001 9910332529303321
005 20230808204309.0
010   $a1-4673-8259-0
035   $a(CKB)4100000008867424
035   $a(WaSeSS)IndRDA00120302
035   $a(EXLCZ)994100000008867424
100   $a20200316d2016      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aProceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) $e18-21 July 2016, Marina Bay Sand, Singapore /$fsponsored by IEEE [and six others]
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2016.
215   $a1 online resource (111 pages)
311   $a1-4673-8260-4 
606   $aIntegrated circuits$xReliability$vCongresses
606   $aIntegrated circuits$xTesting$vCongresses
615  0$aIntegrated circuits$xReliability
615  0$aIntegrated circuits$xTesting
676   $a629.831
712 02$aInstitute of Electrical and Electronics Engineers,
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a9910332529303321
996   $aProceedings of the 2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)$92532474
997   $aUNINA