LEADER 01493nam2 22003011i 450 001 SUN0053868 005 20061002120000.0 010 $a90-619-1769-7 100 $a20061002d1987 |0engc50 ba 101 $aeng 102 $aNL 105 $a|||| ||||| 200 1 $aConcrete and concrete structures$feditor Folker H. Wittmann, coordinators Zdenek P. Bazant, Thomas Zimmermann 210 $aRotterdam [etc.]$cBalkema$d1987 215 $aXIII, 626 p.$d25 cm. 461 1$1001SUN0053727$12001 $aTransactions of the 9th international conference on structural mechanics in reactor technology$eLausanne, 17-21 August 1987$feditor Folker H. Wittmann$vH$1210 $aRotterdam [etc.]$cBalkema$d1987$1215 $a14 v. in 15 t.$cill.$d25 cm. 620 $dRotterdam$3SUNL000157 702 1$aWittmann$b, Folker H.$3SUNV042439 702 1$aBazant$b, Zdenek P.$3SUNV042573 702 1$aZimmermenn$b, Thomas$3SUNV042574 710 12$aInternational conference on structural mechanics in reactor technology$d9$e: Lausanne : 1987$3SUNV042441$0730592 712 $aBalkema$3SUNV000498$4650 801 $aIT$bSOL$c20181109$gRICA 912 $aSUN0053868 950 $aUFFICIO DI BIBLIOTECA DEI DIPARTIMENTI DI INGEGNERIA$d05 CONS G III 347 $e05 59754 995 $aUFFICIO DI BIBLIOTECA DEI DIPARTIMENTI DI INGEGNERIA$bIT-CE0100$h59754$kCONS G III 347$oc$qa 996 $aConcrete and concrete structures$91404814 997 $aUNICAMPANIA LEADER 02933oam 2200637I 450 001 9910456760703321 005 20200520144314.0 010 $a9780429896980 010 $a0-429-90005-8 010 $a0-429-47528-4 010 $a1-283-06935-0 010 $a9786613069351 010 $a1-84940-571-9 024 7 $a10.4324/9780429475283 035 $a(CKB)2550000000032394 035 $a(EBL)690196 035 $a(OCoLC)723944657 035 $a(SSID)ssj0000522888 035 $a(PQKBManifestationID)11340822 035 $a(PQKBTitleCode)TC0000522888 035 $a(PQKBWorkID)10529037 035 $a(PQKB)11674308 035 $a(MiAaPQ)EBC690196 035 $a(Au-PeEL)EBL690196 035 $a(CaPaEBR)ebr10464003 035 $a(CaONFJC)MIL306935 035 $a(OCoLC)1029237923 035 $a(EXLCZ)992550000000032394 100 $a20180706d2007 uy 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aGestalt therapy $ethe art of contact /$fSerge Ginger ; translated by Sarah Spargo and Sally Reeder Cojean 210 1$aLondon :$cKarnac,$d2007. 215 $a1 online resource (240 p.) 300 $aDescription based upon print version of record. 311 $a0-367-32467-9 311 $a1-85575-571-8 320 $aIncludes bibliographical references (p. 142-146) and index. 327 $aCover; Copy Right; ABOUT THE AUTHOR; FOREWORD; INTRODUCTION; 1: What is Gestalt?; 2: The Therapist is incarnate; 3: Fritz Perls, the Father of Gestalt Therapy; 4: The Theory of the Self; 5: Gestalt-Pedagogy and Socio-Gestalt; 6: Gestalt and the Brain; 7: Dreams in Gestalt Therapy; 8: The Body, the Emotions; 9: Vital Drives: Aggression and Sexuality; 10: The Personality Profile (Psychopathology); 11: Twenty Basic Notions; ANNEXES; Short bibliography: in English; Short bibliography: in French; Practical information 330 $aGestalt Therapy has been developing steadily for the last 50 years in America as well as in Europe. It is currently practiced in different settings: individual, group, and family therapies; personal growth; social, medical and business organizations. This book describes a specific French approach: a synthesis of French culture (greatly influenced by psychoanalysis) along with a mobilizing and interactive method, emphasizing the cycle of contact, evoking the emotions, the body and the right hemisphere of the brain. This book is written mostly for beginners and for psychotherapy clients: it summ 606 $aGestalt therapy 606 $aGestalt therapists 608 $aElectronic books. 615 0$aGestalt therapy. 615 0$aGestalt therapists. 676 $a616.89/143 700 $aGinger$b Serge$0287894 801 0$bFlBoTFG 801 1$bFlBoTFG 906 $aBOOK 912 $a9910456760703321 996 $aGestalt therapy$91896517 997 $aUNINA LEADER 10281nam 2200529 450 001 9910271018703321 005 20221206094305.0 010 $a1-119-28966-1 010 $a1-119-28967-X 010 $a1-119-28965-3 024 7 $a10.1002/9781119289654 035 $a(CKB)4100000002964838 035 $a(MiAaPQ)EBC5341524 035 $a(CaBNVSL)mat08340184 035 $a(IDAMS)0b00006487cb64f7 035 $a(IEEE)8340184 035 $a(EXLCZ)994100000002964838 100 $a20180605d2018 uy 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D IC and RF SiPs $eadvanced stacking and planar solutions for 5G mobility /$fby Professor Lih-Tyng Hwang, Professor Tzyy-Sheng Jason Horng 205 $a1st edition. 210 1$aHoboken, New Jersey :$cJohn Wiley & Sons,$d2018. 210 2$a[Piscataqay, New Jersey] :$cIEEE Xplore,$d[2018] 215 $a1 online resource (464 pages) 311 $a1-119-28964-5 320 $aIncludes bibliographical references and index. 327 $a1 MM and MTM for Mobility 1 -- 1.1 Convergence in Communications and the Future, 5G 3 -- 1.1.1 From 1980 (1G) to 2010 (4G) 3 -- 1.1.2 LTE-A and Rel 10 in 2010s 6 -- 1.1.3 The Future: 5G and IoT (Targeting 2020) 8 -- 1.2 Review of Key Products in Communication Networks 14 -- 1.2.1 Wired Communications 14 -- 1.2.2 Wireless Communications 21 -- 1.3 MM and MTM, an Intro to Hardware Technology 31 -- 1.3.1 Moore's Law 31 -- 1.3.2 More Than Moore 43 -- 1.3.3 MTM Packaging Map and MMi? MTM Business Model 53 -- 2 Interconnects 67 -- 2.1 Hierarchy of Interconnection 69 -- 2.1.1 Oni? Chip (Level 0) Interconnections 69 -- 2.1.2 Peripheral Pads on Semiconductor ICs (Level 0) 72 -- 2.1.3 Al pads (Wirebond and Flip Chip) 73 -- 2.1.4 Cu/Lowi? K Re-Distribution Using Damascene Techniques (Flip Chip) 74 -- 2.1.5 Au Pads (III-V) 77 -- 2.1.6 Level 1 Interconnections: WB and FC--Why FC Interconnections are Preferred? 78 -- 2.2 Level 1, Interconnection Gap in FC-PBGA, and Level 0.5 80 -- 2.2.1 Wirebonds 80 -- 2.2.2 Flip Chip Bumps with UBM 85 -- 2.2.3 TSV and Microbumps, Cu or Au Stud Bumps (Level 0.5) 91 -- 2.3 Changing Dynamics of Semiconductor Manufacturing 100 -- 2.3.1 Bumping Itself is a Business 100 -- 2.3.2 Cu/Low-K in BEOL 102 -- 2.3.3 Wafer Fab Foundry and OSAT are Competing for Their Business Shares 102 -- 3 Statei? of i?thei? Art IC Packages, Modules, and Substrates 111 -- 3.1 Single-Chip Packages (SCPs): Standardized Packages 113 -- 3.1.1 Lead Frame Based: SO, QFP/QFN, and TAB 114 -- 3.1.2 Organic Interposer Based: BGA/CSP and LGA 114 -- 3.1.3 Known Good Bare Die 120 -- 3.1.4 Single-Chip Packaging Processes 121 -- 3.1.5 IC Testing 123 -- 3.2 Advanced IC Substrates and Assembly 124 -- 3.2.1 MLO Substrates for ICs 126 -- 3.2.2 Multi-Layered Organic (MLO) for IC Packages 127 -- 3.3 Customized Assemblies: MCP/MCMs and Modules 130 -- 3.3.1 Multi-Chip Module (MCM) or Multi-Chip Package (MCP) 131 -- 3.3.2 Modules 132 -- 4 Passives Technology 139 -- 4.1 Thick-Film Ceramic Technology (TFC) for MLC 146. 327 $a4.1.1 Green Tapes 146 -- 4.1.2 Thick-Film Fabrication 149 -- 4.1.3 LTCC EPs, Thick-Film IPD, and LTCC-Based RF Modules 151 -- 4.1.4 SMT (or SMD) 155 -- 4.2 MLO Passives by Laminate Organic (LO) 156 -- 4.2.1 MLO-Based RF Modules 156 -- 4.2.2 Laminates 156 -- 4.2.3 MLO Fabrication 157 -- 4.2.4 MLO EPs and RF Modules 159 -- 4.3 On-Chip Passives 166 -- 4.3.1 RF Isolation (BCM4330) 166 -- 4.3.2 Monolithic FEOL On-Chip Passives 168 -- 4.3.3 Rs, Ls, and Cs in BEOL Layers 170 -- 4.3.4 Goals 172 -- 4.4 Thin-Film Multilayer (TFM) and IPD 173 -- 4.5 Summary on Passives Fabrication Technologies: Solutions for RF-Passives Systems 191 -- 5 Electrical Design for 5G Hardware--Digital Focus 199 -- 5.1 Introduction to PCB 201 -- 5.2 Signal Transmission Techniques: Singled-Ended and Differential Signals 202 -- 5.2.1 Single-Ended and Differential 202 -- 5.3 Co-Design Examples 216 -- 5.3.1 Interconnection RF Models and Library 216 -- 5.3.2 Chip-Package and Chip-Package-Board Co-Designs 219 -- 5.4 Wide I/O Memory Using TSVs 228 -- 5.4.1 JEDEC Memory Standards 230 -- 5.4.2 Data Structure Using TSV-Based Wide I/O 230 -- 6 Electrical Design for 5G Hardware--RF Focus 239 -- 6.1 PHY, Modulated RF Carriers; a PoP Possible? 240 -- 6.1.1 Frequency Bands and Wave Propagation Characteristics 240 -- 6.1.2 Narrow-Band Process and CW Carrier for Digital Signals 242 -- 6.2 Antennas 244 -- 6.2.1 Two Often Encountered RF Passive Structures in Modern Portable Electronics: Antenna and Its Feed 244 -- 6.2.2 Types of Antennas: Linear, Microstrip-Patch, and Multi-Element Antenna 245 -- 6.2.3 Active-Integrated Antennas and Measurement of Antenna Performance 251 -- 6.3 RF Functional Components 256 -- 6.3.1 Bandpass Filters 256 -- 6.3.2 Baluns 257 -- 6.3.3 Switches and Duplexers 262 -- 6.4 EMI/EMC 263 -- 6.4.1 Sources of Interference 264 -- 6.4.2 Diagnostic and Regulations Conformation Techniques 264 -- 6.4.3 Containment Techniques 267 -- 7 Product, Process Development, and Control 271. 327 $a7.1 Business Processes 272 -- 7.1.1 Strategic Management (Product and Process Development) 272 -- 7.1.2 Design and Manufacturing; Outsourced or Not 273 -- 7.2 History of Statistical Approach for Quality Management 273 -- 7.2.1 Quality Guidelines and Standards 274 -- 7.2.2 Semiconductor Process Development and Characterization 274 -- 7.3 APQP--An Iterative Process for Product and Process Development 275 -- 7.3.1 Translate Product Ideas Into Processes 275 -- 7.4 FMEA, Control Plan, and Initial Process Study 276 -- 7.4.1 RPN 276 -- 7.4.2 Locating the Root Causes 281 -- 7.4.3 Pre-Launch Control Plan 283 -- 7.4.4 Initial Process Study 284 -- 7.5 PPAP and SPC 287 -- 7.5.1 PPAP 287 -- 7.5.2 SPC 287 -- 8 Product Life and Reliability Assessment 291 -- 8.1 Product Life Prediction 292 -- 8.1.1 Calculate MTTF from Processes and Theoretical Distributions 293 -- 8.1.2 Practices to Obtain the Expected Product Life 296 -- 8.1.3 Activation Energy 300 -- 8.2 Reliability Assessment 301 -- 8.2.1 Assessment Variables for Reliability Tests 302 -- 8.2.2 Reliability Assessment Practices 303 -- 8.2.3 Discussions on Weibull Analysis and Weibull Plotting 309 -- 9 Hardware Solutions for 5G Mobility 317 -- 9.1 5G Mobility Products and Planar Solutions 318 -- 9.1.1 High-Density and Logic Products 319 -- 9.1.2 RF-Passives Systems 326 -- 9.1.3 A Summary: WLP and LPP Used for Both HD&L and RF-Passives Products 333 -- 9.2 Advanced Interconnection and Future Business Model 336 -- 9.2.1 Advanced Interconnection 336 -- 9.2.2 New Business Model 341 -- 9.3 Finale--What's Not 343 -- 9.3.1 New from Wafer Foundries 343 -- 9.3.2 System and Architectural Design of Mobile Handsets 345 -- 9.3.3 Thermo-Mechanical and Thermal Science 349 -- 9.3.4 Sensors and IoT 349 -- A Failure Mechanisms and Failure Analysis 357 -- A.1 Failure Mechanisms, or Macroscopic Models 358 -- A.1.1 Silicon Oxide Breakdown 359 -- A.1.2 Stress-Induced Migration (SM) 360 -- A.1.3 Electro-Migration (EM) and Hillocks 360. 327 $aA.1.4 Spiking 362 -- A.1.5 IMC, Purple plague (Gold-Al Intermetallics) 363 -- A.1.6 Fatigue and Creeping 364 -- A.1.7 Die Cracking 366 -- A.1.8 Delamination and Popcorning 366 -- A.1.9 Corrosion 367 -- A.2 Failure Analysis (FA) Techniques and FA Tools 368 -- A.2.1 De-Processing (or De-Capping) Techniques 368 -- A.2.2 Microscopic and Analytical Tools 369 -- B ANOVA 375 -- B.1 One-Way ANOVA 376 -- B.2 Two-Way ANOVA 377 -- C Gauge R&R and DOE 381 -- C.1 GR&R 381 -- C.1.1 AIAG's Xbar/Range Method for Gauge R&R Study 381 -- C.1.2 Minitab 383 -- C.1.3 GR&R Casted in the ANOVA Format 383 -- C.1.4 Criteria 384 -- C.2 DOE 384 -- C.2.1 DOE Guidelines 385 -- C.2.2 2k Runs, Unreplicated Case 386 -- C.2.3 Fractional Factorial Designs, 2k-p Run, p = 1, 2,.., < k 399 -- D Statistics Tables 409 -- D.1 F Distribution 409 D.2 Poisson Table of Expected # of Occurrences at a Confidence Level (C.L.) 409 -- D.3 MR Percentile Table 409. 330 $a 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility Lih-Tyng Hwang, National Sun Yat-Sen University, Taiwan, Jason Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan A concise summary of the state of the art, this book is an interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments. Readers are introduced to the markets, technology drivers, integrated circuits, packaging and substrate trends that go hand-in-hand with the development of 3D IC and RF SiP, as well as related digital and RF designs, and product life and reliability assessments. Smart phone tear-down is used to illustrate the key components for mobility (4G and future 5G), such as AP/mobile memory and RFIC/RF FE. Other essential topics include packaging technology, high density logic design, RF system integration and future trends in MTM technology. . Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility. Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab. Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail. Provides chapter-wise review questions and powerpoint slides as teaching tools 3D IC and RF SiPs offers graduate students and researchers an essential guide to advanced stacking and planar solutions for 5G mobility. It can also be used as a reference text for engineers and advanced students of semiconductors, communications hardware, and IC packaging technologies. 606 $aMobile communication systems$xTechnological innovations 615 0$aMobile communication systems$xTechnological innovations. 676 $a621.39/5 700 $aHwang$b Lih-Tyng$01217263 702 $aHorng$b Tzyy-sheng Jason 801 0$bCaBNVSL 801 1$bCaBNVSL 801 2$bCaBNVSL 906 $aBOOK 912 $a9910271018703321 996 $a3D IC and RF SiPs$92815248 997 $aUNINA LEADER 03043 am 2200637 n 450 001 9910328156703321 005 20190412 010 $a2-7351-1919-X 024 7 $a10.4000/books.editionsmsh.14856 035 $a(CKB)4100000008496675 035 $a(FrMaCLE)OB-editionsmsh-14856 035 $a(oapen)https://directory.doabooks.org/handle/20.500.12854/47285 035 $a(PPN)236941208 035 $a(EXLCZ)994100000008496675 100 $a20190624j|||||||| ||| 0 101 0 $afre 135 $auu||||||m|||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 13$aLa fabrique de la démocratie $eONG, fondations, think tanks et organisations internationales en action /$fBoris Petric 210 $aParis $cÉditions de la Maison des sciences de l?homme$d2019 215 $a1 online resource (320 p.) 311 $a2-7351-1520-8 330 $aDepuis la chute du mur de Berlin, les discours politiques et les valeurs qu'ils véhiculent n'ont plus le monopole de la promotion de la démocratie et de la bonne gouvernance. Des agences de coopération, des ONG, des fondations et des organisations internationales coproduisent des politiques publiques dans un certain nombre de pays en transition et qui sont en train de réformer leur système politique. Cet ouvrage réunit des études de cas concernant une variété de pays (Afghanistan, Sénégal, Kirghizstan, Cuba, Serbie, Bulgarie, Pakistan, Nigeria, Bolivie, Azerbaïdjan, Indonésie) pour mettre au jour l'unicité d'un nouveau dispositif de pouvoir transnational qui s'impose à l'échelle mondiale. Guidés par une démarche comparative, les auteurs de cet ouvrage tentent de répondre à la question suivante : Ce nouveau dispositif participe-t-il à l'universalisation de la démocratie ou à la généralisation d'une forme de pouvoir transnational inédit ? 606 $aInternational agencies 606 $aNon-governmental organizations 606 $aDemocracy 610 $agouvernance 610 $aorganisation non gouvernementale 610 $apouvoir 610 $afondation 610 $adémocratie 610 $athink tank 610 $atransnationalisme 610 $asouveraineté 615 0$aInternational agencies. 615 0$aNon-governmental organizations. 615 0$aDemocracy. 700 $aAnguelova-Lavergne$b Dostena$01291079 701 $aBertrand$b Romain$0739333 701 $aBlundo$b Giorgio$0281939 701 $aDimitrijevic$b Dejan$01287518 701 $aHussain$b Shafqat$01291080 701 $aMathey$b Raphaëlle$01291081 701 $aMonsutti$b Alessandro$01113340 701 $aPérouse de Montclos$b Marc-Antoine$01285173 701 $aPetric$b Boris$01291078 701 $aRecondo$b David$0924529 701 $aVetta$b Theodora$01291082 701 $aPetric$b Boris$01291078 801 0$bFR-FrMaCLE 906 $aBOOK 912 $a9910328156703321 996 $aLa fabrique de la démocratie$93021781 997 $aUNINA