LEADER 01376nam  2200373   450 
001 9910326658803321
005 20230817180518.0
010   $a4-904743-07-5
035   $a(CKB)4100000008419327
035   $a(WaSeSS)IndRDA00123063
035   $a(EXLCZ)994100000008419327
100   $a20200518d2019      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aLTB-3D $e2019 6th International Workshop on Low Temperature Bonding for 3D Integration : proceedings of 2019 6th International Workshop on Low Temperature Bonding for 3D Integration, May 21 -25, 2019, Kanazawa, Ishikawa, Japan /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2019.
215   $a1 online resource (90 pages)
311   $a1-7281-0387-8 
606   $aThree-dimensional integrated circuits $vCongresses
606   $aSealing (Technology)$vCongresses
606   $aPhotonics$xMaterials$vCongresses
615  0$aThree-dimensional integrated circuits 
615  0$aSealing (Technology)
615  0$aPhotonics$xMaterials
676   $a621.885
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a9910326658803321
996   $aLTB-3D$92497176
997   $aUNINA