LEADER 04395nam  22006855  450 
001 9910299940603321
005 20200703092235.0
010   $a3-319-77872-2
024 7 $a10.1007/978-3-319-77872-3
035   $a(CKB)4100000003359558
035   $a(MiAaPQ)EBC5376068
035   $a(DE-He213)978-3-319-77872-3
035   $a(PPN)226697002
035   $a(EXLCZ)994100000003359558
100   $a20180427d2018      u|         0
101 0 $aeng
135   $aurcnu||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering $eWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /$fby Seonho Seok
205   $a1st ed. 2018.
210  1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2018.
215   $a1 online resource (119 pages)
225 1 $aSpringer Series in Advanced Manufacturing,$x1860-5168
311   $a3-319-77871-4 
327   $aOverview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .
330   $aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ? a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load?displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
410  0$aSpringer Series in Advanced Manufacturing,$x1860-5168
606   $aManufactures
606   $aNanotechnology
606   $aMaterials science
606   $aTribology
606   $aCorrosion and anti-corrosives
606   $aCoatings
606   $aManufacturing, Machines, Tools, Processes$3https://scigraph.springernature.com/ontologies/product-market-codes/T22050
606   $aNanotechnology$3https://scigraph.springernature.com/ontologies/product-market-codes/Z14000
606   $aNanotechnology and Microengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T18000
606   $aCharacterization and Evaluation of Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z17000
606   $aTribology, Corrosion and Coatings$3https://scigraph.springernature.com/ontologies/product-market-codes/Z15000
615  0$aManufactures.
615  0$aNanotechnology.
615  0$aMaterials science.
615  0$aTribology.
615  0$aCorrosion and anti-corrosives.
615  0$aCoatings.
615 14$aManufacturing, Machines, Tools, Processes.
615 24$aNanotechnology.
615 24$aNanotechnology and Microengineering.
615 24$aCharacterization and Evaluation of Materials.
615 24$aTribology, Corrosion and Coatings.
676   $a658.51
700   $aSeok$b Seonho$4aut$4http://id.loc.gov/vocabulary/relators/aut$01059307
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910299940603321
996   $aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering$92505255
997   $aUNINA