LEADER 05632nam 22008533u 450 001 9910456659903321 005 20210107035031.0 010 $a1-84719-685-3 010 $a9786612255557 010 $a1-282-25555-X 035 $a(CKB)2430000000040714 035 $a(EBL)951165 035 $a(OCoLC)797915653 035 $a(SSID)ssj0000347696 035 $a(PQKBManifestationID)11232463 035 $a(PQKBTitleCode)TC0000347696 035 $a(PQKBWorkID)10345449 035 $a(PQKB)10212551 035 $a(CaSebORM)9781847196842 035 $a(MiAaPQ)EBC951165 035 $a(PPN)228028752 035 $a(EXLCZ)992430000000040714 100 $a20130418d2009 uy| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aIBM Cognos 8 Planning$b[electronic resource] /$fNed Riaz, Jason Edwards, Rich Babaran 205 $a1st edition 210 $aBirmingham $cPackt Publishing$d2009 215 $a1 online resource (424 p.) 225 1 $aFrom technologies to solutions 300 $aDescription based upon print version of record. 311 $a1-84719-684-5 327 $aCover; Table of Contents; Preface; Chapter 1: Planning with IBM Cognos; Planning in a dynamic business environment; Common problems with the planning process; Disconnect between operating reality and financial plan; Confrontational versus collaborative; Cycle times; Ownership and accountability; Spreadsheet-based planning; Lack of control; Spreadsheet error; Lack of transparency; Consolidation and version control; How technology enables planning best practices; Introducing IBM Cognos Planning; Corporate Performance Management; Benefits of IBM Cognos Planning; Summary 327 $aChapter 2: Getting to know IBM Cognos ToolsScenario; IBM Cognos Planning - Contributor; Contributor administration; Contributor client; IBM Cognos Excel add-in for Analyst and Contributor; IBM Cognos Metric Designer and Metric Studio; Metric Designer; Metric Studio; IBM Cognos Reporting Studios; IBM Cognos Framework Manager; IBM Cognos Event Studio; IBM Cognos Connection web portal; Summary; Chapter 3: Understanding the Model Development Process; The process; Considerations for building an Analyst planning model; Planning functional models; Planning cycles and horizons; Planning approaches 327 $aDesigning the model template in AnalystFlowcharting the model structure; The concept of multi dimensionality; Understanding dimensions, datastore, and data flow; Determining dimensions: D-List; Building the datastore: D-Cubes; Controlling data flow: D-Links; What makes an optimal model?; Principles of model building; Building the Contributor application; Entering and reviewing plans in the Contributor Web user interface; Publishing and reporting planning data; Maintaining the planning models; Example: ABC Company; Summary; Chapter 4: Understanding the Analyst Environment 327 $aGetting familiar with AnalystUsing Analyst shortcuts; Accessing Analyst objects; Navigating within Analyst; The building blocks of an Analyst model; Analyst objects; D-List; D-Cube; D-Link; Allocation Table (A-Table); File Map; Saved Format; Saved Selection; Macro; Organizing objects by using libraries; Creating a library; Deleting a library; Considerations for creating libraries; Types of libraries; Common library; Model library; Staging library; Archive library; Basic administration tools; Maintain Libraries and Users; Rebuild the index file; Refresh references; Validate D-Lists 327 $aLocate ODBC sourcesLocate Built-in Functions; Configuring Analyst; Changing the path to the Filesys.ini; Changing the maximum workspace; Changing keyboard layout; Changing the number of undos and redos; Summary; Chapter 5: Defining Data Structures: D-List; Overview of D-List; Creating the D-List; Manually typing the D-List Items; Importing D-List items from an ASCII file; Importing the D-List items from a File Map; Importing the D-List items from an ODBC source; Importing the D-List items from data in a D-Cube; Importing the D-List Items from another D-List; Modifying the import parameters 327 $aUpdating the D-List 330 $aEngineer a clear-cut strategy for achieving best-in-class results using IBM Cognos 8 Planning with this book and eBook 410 0$aFrom technologies to solutions 606 $aIBM software 606 $aManagement information systems 606 $aBusiness intelligence$xComputer programs 606 $aBusiness intelligence -- Computer programs 606 $aBusiness intelligence -- Data processing 606 $aData warehousing 606 $aManagement Styles & Communication$2HILCC 606 $aManagement$2HILCC 606 $aBusiness & Economics$2HILCC 608 $aElectronic books. 615 0$aIBM software. 615 0$aManagement information systems. 615 0$aBusiness intelligence$xComputer programs. 615 4$aBusiness intelligence -- Computer programs. 615 4$aBusiness intelligence -- Data processing. 615 4$aData warehousing. 615 7$aManagement Styles & Communication 615 7$aManagement 615 7$aBusiness & Economics 676 $a658.4038011 700 $aEdwards$b Jason$factive 2000.$0905708 701 $aRiaz$b Ned$0905709 701 $aBabaran$b Rich$0905710 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 801 2$bAzTeS 906 $aBOOK 912 $a9910456659903321 996 $aIBM Cognos 8 Planning$92025853 997 $aUNINA LEADER 04395nam 22006855 450 001 9910299940603321 005 20200703092235.0 010 $a3-319-77872-2 024 7 $a10.1007/978-3-319-77872-3 035 $a(CKB)4100000003359558 035 $a(MiAaPQ)EBC5376068 035 $a(DE-He213)978-3-319-77872-3 035 $a(PPN)226697002 035 $a(EXLCZ)994100000003359558 100 $a20180427d2018 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering $eWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /$fby Seonho Seok 205 $a1st ed. 2018. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2018. 215 $a1 online resource (119 pages) 225 1 $aSpringer Series in Advanced Manufacturing,$x1860-5168 311 $a3-319-77871-4 327 $aOverview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. . 330 $aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ? a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load?displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 410 0$aSpringer Series in Advanced Manufacturing,$x1860-5168 606 $aManufactures 606 $aNanotechnology 606 $aMaterials science 606 $aTribology 606 $aCorrosion and anti-corrosives 606 $aCoatings 606 $aManufacturing, Machines, Tools, Processes$3https://scigraph.springernature.com/ontologies/product-market-codes/T22050 606 $aNanotechnology$3https://scigraph.springernature.com/ontologies/product-market-codes/Z14000 606 $aNanotechnology and Microengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T18000 606 $aCharacterization and Evaluation of Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z17000 606 $aTribology, Corrosion and Coatings$3https://scigraph.springernature.com/ontologies/product-market-codes/Z15000 615 0$aManufactures. 615 0$aNanotechnology. 615 0$aMaterials science. 615 0$aTribology. 615 0$aCorrosion and anti-corrosives. 615 0$aCoatings. 615 14$aManufacturing, Machines, Tools, Processes. 615 24$aNanotechnology. 615 24$aNanotechnology and Microengineering. 615 24$aCharacterization and Evaluation of Materials. 615 24$aTribology, Corrosion and Coatings. 676 $a658.51 700 $aSeok$b Seonho$4aut$4http://id.loc.gov/vocabulary/relators/aut$01059307 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910299940603321 996 $aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering$92505255 997 $aUNINA