LEADER 02565nam 22004335 450 001 9910299927103321 005 20230120081052.0 010 $a9789811088841 035 $aEBL5342050 035 $a(CKB)4100000003359788 035 $a(DE-He213)978-981-10-8884-1 035 $a(MiAaPQ)EBC5342050 035 $a(PPN)226695042 035 $a(BIP)76732014 035 $a(EXLCZ)994100000003359788 100 $a20180405d2018 u| 0 101 0 $aeng 135 $aurcnu|||||||| 181 $2rdacontent 182 $2rdamedia 183 $2rdacarrier 200 10$aFan-out wafer-level packaging /$fby John H. Lau 210 1$aSingapore :$cSpringer Singapore :$cSpringer,$d2018. 210 4$dİ2018 215 $a1 online resource (319 pages) 330 $aThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple's iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP - such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. - are not well understood.  Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP. 606 $aElectronic circuits 606 $aNanotechnology 606 $aOptical materials 606 $aElectronics$xMaterials 615 0$aElectronic circuits. 615 0$aNanotechnology. 615 0$aOptical materials. 615 0$aElectronics$xMaterials. 676 $a621.381046 700 $aLau$b John H.$0972648 912 $a9910299927103321 996 $aFan-Out Wafer-Level Packaging$92528753 997 $aUNINA