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100   $a20171116d2018      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aContactless VLSI Measurement and Testing Techniques /$fby Selahattin Sayil
205   $a1st ed. 2018.
210  1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2018.
215   $a1 online resource (V, 93 p. 34 illus., 11 illus. in color.) 
311 08$a3-319-69672-6 
320   $aIncludes bibliographical references at the end of each chapters.
327   $a1. Conventional Test Methods. ? 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
330   $aThis book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
606   $aElectronic circuits
606   $aMicroprocessors
606   $aComputer architecture
606   $aElectronics
606   $aElectronic Circuits and Systems
606   $aProcessor Architectures
606   $aElectronics and Microelectronics, Instrumentation
615  0$aElectronic circuits.
615  0$aMicroprocessors.
615  0$aComputer architecture.
615  0$aElectronics.
615 14$aElectronic Circuits and Systems.
615 24$aProcessor Architectures.
615 24$aElectronics and Microelectronics, Instrumentation.
676   $a621.3815
700   $aSayil$b Selahattin$4aut$4http://id.loc.gov/vocabulary/relators/aut$0763561
906   $aBOOK
912   $a9910299887103321
996   $aContactless VLSI Measurement and Testing Techniques$92527392
997   $aUNINA