LEADER 04477nam 22006975 450 001 9910299850503321 005 20200707024131.0 010 $a3-319-10295-8 024 7 $a10.1007/978-3-319-10295-5 035 $a(CKB)3710000000268426 035 $a(EBL)1965227 035 $a(OCoLC)908083111 035 $a(SSID)ssj0001372467 035 $a(PQKBManifestationID)11761796 035 $a(PQKBTitleCode)TC0001372467 035 $a(PQKBWorkID)11304280 035 $a(PQKB)10557532 035 $a(DE-He213)978-3-319-10295-5 035 $a(MiAaPQ)EBC1965227 035 $a(MiAaPQ)EBC4924801 035 $a(Au-PeEL)EBL4924801 035 $a(CaONFJC)MIL766642 035 $a(OCoLC)894509026 035 $a(PPN)182094219 035 $a(EXLCZ)993710000000268426 100 $a20141025d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aDry Etching Technology for Semiconductors /$fby Kazuo Nojiri 205 $a1st ed. 2015. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2015. 215 $a1 online resource (126 p.) 300 $aDescription based upon print version of record. 311 $a3-319-10294-X 320 $aIncludes bibliographical references. 327 $aContribution of Dry Etching Technology to Progress of Semiconductor Integrated Circuit -- Mechanism of Dry Etching -- Dry Etching of Various Materials -- Dry Etching Equipments -- Dry Etching Damage -- Latest Dry Etching Technologies -- Future Challenges and Outlook for Dry Etching Technology. 330 $aThis book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits.  The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes.  The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc. Provides a comprehensive, systematic guide to dry etching technologies, from basics to latest technologies; Enables beginners to understand the mechanisms of dry etching, without complexities of numerical formulas/equations; Describes etching processes for all materials which are used in semiconductor devices, explains key etching parameters for each material, and explains why a particular plasma source and etching gas chemistry is used for each material; Discusses the device manufacturing flow and explains in which part of device manufacturing dry etching is actually used; Describes the types and plasma generation mechanism of etching equipment which are actually used in semiconductor fabs, such as CCP (Capacitively Coupled Plasma), Magnetron RIE (Magnetron Reactive Ion Etching), ECR (Electron Cyclotron Resonance) Plasma, and ICP (Inductively Coupled Plasma). 606 $aElectronic circuits 606 $aSemiconductors 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aSemiconductors$3https://scigraph.springernature.com/ontologies/product-market-codes/P25150 615 0$aElectronic circuits. 615 0$aSemiconductors. 615 14$aCircuits and Systems. 615 24$aElectronic Circuits and Devices. 615 24$aSemiconductors. 676 $a537.622 676 $a620 676 $a621.3815 700 $aNojiri$b Kazuo$4aut$4http://id.loc.gov/vocabulary/relators/aut$0720691 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910299850503321 996 $aDry Etching Technology for Semiconductors$91412451 997 $aUNINA