LEADER 03691nam 22007095 450 001 9910299704803321 005 20251117080025.0 010 $a81-322-2047-1 024 7 $a10.1007/978-81-322-2047-3 035 $a(CKB)3710000000271854 035 $a(EBL)1968552 035 $a(SSID)ssj0001386209 035 $a(PQKBManifestationID)11759662 035 $a(PQKBTitleCode)TC0001386209 035 $a(PQKBWorkID)11352059 035 $a(PQKB)11302201 035 $a(DE-He213)978-81-322-2047-3 035 $a(MiAaPQ)EBC1968552 035 $a(PPN)183091167 035 $a(EXLCZ)993710000000271854 100 $a20141101d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aCarbon Nanotube Based VLSI Interconnects $eAnalysis and Design /$fby Brajesh Kumar Kaushik, Manoj Kumar Majumder 205 $a1st ed. 2015. 210 1$aNew Delhi :$cSpringer India :$cImprint: Springer,$d2015. 215 $a1 online resource (94 p.) 225 1 $aSpringerBriefs in Applied Sciences and Technology,$x2191-530X 300 $aDescription based upon print version of record. 311 08$a81-322-2046-3 320 $aIncludes bibliographical references. 327 $aInterconnects -- Carbon Nanotube ? Properties and Applications -- Modeling of Carbon Nanotube Interconnects -- Crosstalk and Delay Analysis -- Mixed Carbon Nanotube Bundle -- References. 330 $aThe brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models. 410 0$aSpringerBriefs in Applied Sciences and Technology,$x2191-530X 606 $aNanotechnology 606 $aElectronic circuits 606 $aOptical materials 606 $aElectronics$xMaterials 606 $aNanotechnology and Microengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T18000 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 615 0$aNanotechnology. 615 0$aElectronic circuits. 615 0$aOptical materials. 615 0$aElectronics$xMaterials. 615 14$aNanotechnology and Microengineering. 615 24$aCircuits and Systems. 615 24$aOptical and Electronic Materials. 676 $a620 676 $a620.11295 676 $a620.11297 676 $a620.5 676 $a621.3815 700 $aKaushik$b Brajesh Kumar$4aut$4http://id.loc.gov/vocabulary/relators/aut$0720783 702 $aMajumder$b Manoj Kumar$4aut$4http://id.loc.gov/vocabulary/relators/aut 906 $aBOOK 912 $a9910299704803321 996 $aCarbon Nanotube Based VLSI Interconnects$92505841 997 $aUNINA