LEADER 03707nam 22006735 450 001 9910299688103321 005 20200701093012.0 010 $a3-319-13951-7 024 7 $a10.1007/978-3-319-13951-7 035 $a(CKB)3710000000379581 035 $a(EBL)3108730 035 $a(SSID)ssj0001465410 035 $a(PQKBManifestationID)11755375 035 $a(PQKBTitleCode)TC0001465410 035 $a(PQKBWorkID)11472415 035 $a(PQKB)10610924 035 $a(DE-He213)978-3-319-13951-7 035 $a(MiAaPQ)EBC3108730 035 $a(PPN)184895871 035 $a(EXLCZ)993710000000379581 100 $a20150323d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aCMOS Front Ends for Millimeter Wave Wireless Communication Systems /$fby Noël Deferm, Patrick Reynaert 205 $a1st ed. 2015. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2015. 215 $a1 online resource (188 p.) 225 1 $aAnalog Circuits and Signal Processing,$x1872-082X 300 $aDescription based upon print version of record. 311 $a3-319-13950-9 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aIntroduction -- CMOS at Millimeter Wave Frequencies -- Passive Devices: Simulation and Design -- Integrated Differential Amplifiers -- Millimeter Wave Transmitters in CMOS -- A 120GHz Wireless Link -- General Conclusions. 330 $aThis book focuses on the development of circuit and system design techniques for millimeter wave wireless communication systems above 90GHz and fabricated in nanometer scale CMOS technologies. The authors demonstrate a hands-on methodology that was applied to design six different chips, in order to overcome a variety of design challenges. Behavior of both actives and passives, and how to design them to achieve high performance is discussed in detail. This book serves as a valuable reference for millimeter wave designers, working at both the transistor level and system level.   Discusses advantages and disadvantages of designing wireless mm-wave communication circuits and systems in CMOS; Analyzes the limitations and pitfalls of building mm-wave circuits in CMOS; Includes mm-wave building block and system design techniques and applies these to 6 different CMOS chips; Provides guidelines for building measurement setups to evaluate high-frequency chips.  . 410 0$aAnalog Circuits and Signal Processing,$x1872-082X 606 $aElectronic circuits 606 $aElectronics 606 $aMicroelectronics 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 615 0$aElectronic circuits. 615 0$aElectronics. 615 0$aMicroelectronics. 615 14$aCircuits and Systems. 615 24$aElectronic Circuits and Devices. 615 24$aElectronics and Microelectronics, Instrumentation. 676 $a621.384 700 $aDeferm$b Noël$4aut$4http://id.loc.gov/vocabulary/relators/aut$0720770 702 $aReynaert$b Patrick$4aut$4http://id.loc.gov/vocabulary/relators/aut 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910299688103321 996 $aCMOS Front Ends for Millimeter Wave Wireless Communication Systems$92542722 997 $aUNINA