LEADER 04289nam 22007335 450 001 9910299663303321 005 20200703014153.0 010 $a1-4614-9266-1 024 7 $a10.1007/978-1-4614-9266-5 035 $a(CKB)3710000000277332 035 $a(EBL)1964846 035 $a(SSID)ssj0001386234 035 $a(PQKBManifestationID)11752473 035 $a(PQKBTitleCode)TC0001386234 035 $a(PQKBWorkID)11374679 035 $a(PQKB)11011499 035 $a(DE-He213)978-1-4614-9266-5 035 $a(MiAaPQ)EBC1964846 035 $a(PPN)18308585X 035 $a(EXLCZ)993710000000277332 100 $a20141105d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aFundamentals of Lead-Free Solder Interconnect Technology $eFrom Microstructures to Reliability /$fby Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma 205 $a1st ed. 2015. 210 1$aNew York, NY :$cSpringer US :$cImprint: Springer,$d2015. 215 $a1 online resource (266 p.) 300 $aDescription based upon print version of record. 311 $a1-4614-9265-3 320 $aIncludes bibliographical references at the end of each chapters and index. 327 $aIntroduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again. 330 $aThis unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering technologies   Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering. 606 $aElectronics 606 $aMicroelectronics 606 $aOptical materials 606 $aElectronic materials 606 $aElectronic circuits 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 615 0$aElectronics. 615 0$aMicroelectronics. 615 0$aOptical materials. 615 0$aElectronic materials. 615 0$aElectronic circuits. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aOptical and Electronic Materials. 615 24$aCircuits and Systems. 676 $a620 676 $a620.11295 676 $a620.11297 676 $a621.381 676 $a621.3815 700 $aLee$b Tae-Kyu$4aut$4http://id.loc.gov/vocabulary/relators/aut$01062018 702 $aBieler$b Thomas R$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aKim$b Choong-Un$4aut$4http://id.loc.gov/vocabulary/relators/aut 702 $aMa$b Hongtao$4aut$4http://id.loc.gov/vocabulary/relators/aut 906 $aBOOK 912 $a9910299663303321 996 $aFundamentals of Lead-Free Solder Interconnect Technology$92522060 997 $aUNINA