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010   $a981-10-6165-3
024 7 $a10.1007/978-981-10-6165-3
035   $a(CKB)4100000000586854
035   $a(DE-He213)978-981-10-6165-3
035   $a(MiAaPQ)EBC5042221
035   $a(PPN)204531306
035   $a(EXLCZ)994100000000586854
100   $a20170908d2018      u|         0
101 0 $aeng
135   $aurnn|008mamaa
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aResearch on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect  /$fby Jie Cheng
205   $a1st ed. 2018.
210  1$aSingapore :$cSpringer Singapore :$cImprint: Springer,$d2018.
215   $a1 online resource (XVIII, 137 p. 103 illus.) 
225 1 $aSpringer Theses, Recognizing Outstanding Ph.D. Research,$x2190-5053
311   $a981-10-6164-5 
320   $aIncludes bibliographical references.
330   $aThis thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
410  0$aSpringer Theses, Recognizing Outstanding Ph.D. Research,$x2190-5053
606   $aManufactures
606   $aTribology
606   $aCorrosion and anti-corrosives
606   $aCoatings
606   $aElectronics
606   $aMicroelectronics
606   $aManufacturing, Machines, Tools, Processes$3https://scigraph.springernature.com/ontologies/product-market-codes/T22050
606   $aTribology, Corrosion and Coatings$3https://scigraph.springernature.com/ontologies/product-market-codes/Z15000
606   $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027
615  0$aManufactures.
615  0$aTribology.
615  0$aCorrosion and anti-corrosives.
615  0$aCoatings.
615  0$aElectronics.
615  0$aMicroelectronics.
615 14$aManufacturing, Machines, Tools, Processes.
615 24$aTribology, Corrosion and Coatings.
615 24$aElectronics and Microelectronics, Instrumentation.
676   $a621.38152
700   $aCheng$b Jie$4aut$4http://id.loc.gov/vocabulary/relators/aut$01064702
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910299588803321
996   $aResearch on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect$92540261
997   $aUNINA