LEADER 04140nam 22007095 450 001 9910298619803321 005 20251230070330.0 010 $a3-319-21194-3 024 7 $a10.1007/978-3-319-21194-7 035 $a(CKB)3710000000460498 035 $a(EBL)4178372 035 $a(SSID)ssj0001546845 035 $a(PQKBManifestationID)16140793 035 $a(PQKBTitleCode)TC0001546845 035 $a(PQKBWorkID)14796022 035 $a(PQKB)10390700 035 $a(DE-He213)978-3-319-21194-7 035 $a(MiAaPQ)EBC3564462 035 $z(PPN)258865326 035 $a(PPN)188458948 035 $a(MiAaPQ)EBC4178372 035 $a(EXLCZ)993710000000460498 100 $a20150806d2015 u| 0 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 10$aNanopackaging: From Nanomaterials to the Atomic Scale $eProceedings of the 1st International Workshop on Nanopackaging, Grenoble 27-28 June 2013 /$fedited by Xavier Baillin, Christian Joachim, Gilles Poupon 205 $a1st ed. 2015. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2015. 215 $a1 online resource (194 p.) 225 1 $aAdvances in Atom and Single Molecule Machines,$x2193-9705 300 $aDescription based upon print version of record. 311 08$a3-319-21193-5 320 $aIncludes bibliographical references at the end of each chapters. 327 $aUtilization of Peridynamic Theory for Modeling at the Nano-scale -- DNA Metallization Processes and Nanoelectronics -- Evaluation of leakage current in 1-D silicon dangling-bond wire due to dopants -- Direct Integration of Carbon Nanotubes in Si Microsystems -- Nanopackaging requirements for atomic scale circuits and molecule-machines -- Single crystal Au triangles as reconfigurable contacts for atomically smooth surfaces: Ultra High Vacuum transfer printing -- Site-selective self-assembly of nano-objects on a planar substrate based on surface chemical functionalization -- Silicon technologies for nano-scale device packaging -- Designing Carbon Nanotubes Interconnects for Radio Frequency Applications -- Packaging of bucky-balls/ bucky?tubes in transparent photo-active inorganic polymers: New hope in the area of electronics and optoelectronics -- Novel Nanostructured Passives for RF and Power Applications: Nanopackaging with Passive Components. 330 $aThis book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community. 410 0$aAdvances in Atom and Single Molecule Machines,$x2193-9705 606 $aNanochemistry 606 $aNanotechnology 606 $aBiophysics 606 $aNanochemistry 606 $aNanotechnology 606 $aBiophysics 615 0$aNanochemistry. 615 0$aNanotechnology. 615 0$aBiophysics. 615 14$aNanochemistry. 615 24$aNanotechnology. 615 24$aBiophysics. 676 $a621.381046 702 $aBaillin$b Xavier$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aJoachim$b Christian$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aPoupon$b Gilles$4edt$4http://id.loc.gov/vocabulary/relators/edt 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910298619803321 996 $aNanopackaging: From Nanomaterials to the Atomic Scale$92276639 997 $aUNINA