LEADER 01666nam 2200373Ia 450 001 996386645703316 005 20221108085110.0 035 $a(CKB)4940000000080747 035 $a(EEBO)2264221352 035 $a(OCoLC)13516309 035 $a(EXLCZ)994940000000080747 100 $a19860501d1687 uy | 101 0 $aeng 135 $aurbn||||a|bb| 200 14$aThe present state of the islands in the archipelago, or Arches, seas of Constantinople and gulph [sic] of Smyrna$b[electronic resource] $ewith the islands of Candia and Rhodes /$ffaithfully describ'd by Ber. Randolph : to which is annexed an index shewing the longitude and latitude of all the places in the new map of Greece lately published by the same author 210 $aPrinted ... in Oxford $c[s.n.]$d1687 215 $a[2], 26, 108, [9] p 300 $a"A relation of a storm and great deliverance at sea in a voyage from New England": p. 98-108. 300 $aThis item is also bound following "The present state of Morea" (Wing R238) at reel 820:41. 300 $aImperfect: First 26 pages lacking on film. 300 $aReproduction of original in Cambridge University Library. 330 $aeebo-0021 607 $aAegean Islands (Greece and Turkey)$xDescription and travel 607 $aCrete (Greece)$xDescription and travel 700 $aRandolph$b Bernard$fb. 1643.$01012487 801 0$bEAA 801 1$bEAA 801 2$bm/c 801 2$bUMI 801 2$bWaOLN 906 $aBOOK 912 $a996386645703316 996 $aThe present state of the islands in the archipelago, or Arches, seas of Constantinople and gulph of Smyrna$92351110 997 $aUNISA LEADER 01266nam 2200361 450 001 9910293159203321 005 20230814225842.0 010 $a1-5386-4933-0 035 $a(CKB)4100000007125731 035 $a(WaSeSS)IndRDA00121295 035 $a(EXLCZ)994100000007125731 100 $a20200327d2018 uy 0 101 0 $aeng 135 $aur||||||||||| 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a2018 13th International Congress Molded Interconnect Devices $eSeptember 25-26 2018, Wu?rzburg, Germany /$fIEEE Electronics Packaging Society 210 1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2018. 215 $a1 online resource (29 pages) 311 $a1-5386-4934-9 606 $aMolded interconnect devices$vCongresses 606 $aThree-dimensional display systems$vCongresses 615 0$aMolded interconnect devices 615 0$aThree-dimensional display systems 676 $a621.381044 712 02$aIEEE Electronics Packaging Society, 801 0$bWaSeSS 801 1$bWaSeSS 906 $aPROCEEDING 912 $a9910293159203321 996 $a2018 13th International Congress Molded Interconnect Devices$92507218 997 $aUNINA