LEADER 01348nam  2200361   450 
001 9910280915703321
005 20230814223104.0
010   $a1-5386-6103-9
035   $a(CKB)4100000005061464
035   $a(WaSeSS)IndRDA00122386
035   $a(EXLCZ)994100000005061464
100   $a20200424d2018      uy             0
101 0 $aeng
135   $aur|||||||||||
181   $ctxt$2rdacontent
182   $cc$2rdamedia
183   $acr$2rdacarrier
200 10$aProceedings for 2018 IEEE COOL Chips 21 $eIEEE Symposium on Low-Power and High-Speed Chips and Systems : Yokohama Joho Bunka Center (Yokohama Media & Communications Center), April 18-20, 2018 /$fInstitute of Electrical and Electronics Engineers
210  1$aPiscataway, New Jersey :$cInstitute of Electrical and Electronics Engineers,$d2018.
215   $a1 online resource (71 pages)
311   $a1-5386-6104-7 
606   $aIntegrated circuits$vCongresses
606   $aVery high speed integrated circuits$vCongresses
615  0$aIntegrated circuits
615  0$aVery high speed integrated circuits
676   $a621.3815
712 02$aInstitute of Electrical and Electronics Engineers,
801  0$bWaSeSS
801  1$bWaSeSS
906   $aPROCEEDING
912   $a9910280915703321
996   $aProceedings for 2018 IEEE COOL Chips 21$92533574
997   $aUNINA