LEADER 03527nam 22005775 450 001 9910254344903321 005 20250521000127.0 010 $a3-319-47597-5 024 7 $a10.1007/978-3-319-47597-4 035 $a(CKB)3850000000027333 035 $a(DE-He213)978-3-319-47597-4 035 $a(MiAaPQ)EBC6312995 035 $a(MiAaPQ)EBC5592754 035 $a(Au-PeEL)EBL5592754 035 $a(OCoLC)985626536 035 $a(PPN)200514202 035 $a(EXLCZ)993850000000027333 100 $a20170430d2017 u| 0 101 0 $aeng 135 $aurnn#008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aNanometer CMOS ICs $eFrom Basics to ASICs /$fby Harry J.M. Veendrick 205 $a2nd ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (XXXVII, 611 p. 445 illus., 271 illus. in color.) 311 08$a3-319-47595-9 327 $aBasic Principles -- Geometrical-, Physical- and Field-Scaling Impact on MOS Transistor Behavior -- Manufacture of MOS Devices -- CMOS Circuits -- Special Circuits, Devices and Technologies -- Memories -- Very Large Scale Integration (VLSI) and ASICs -- Low Power, a Hot Topic in IC Design -- Robustness of Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug and Failure Analysis -- Effects of Scaling on MOS IC Design and Consequences for the Roadmap. 330 $aThis textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software. 606 $aElectronic circuits 606 $aElectronics 606 $aMicroelectronics 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 615 0$aElectronic circuits. 615 0$aElectronics. 615 0$aMicroelectronics. 615 14$aCircuits and Systems. 615 24$aElectronic Circuits and Devices. 615 24$aElectronics and Microelectronics, Instrumentation. 676 $a621.395 700 $aVeendrick$b H. J. M$g(Harry J. M.)$4aut$4http://id.loc.gov/vocabulary/relators/aut$01819742 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910254344903321 996 $aNanometer CMOS ICs$94380255 997 $aUNINA