LEADER 03990nam 22005175 450 001 9910254168803321 005 20200705084959.0 010 $a3-319-29746-5 024 7 $a10.1007/978-3-319-29746-0 035 $a(CKB)3710000000746175 035 $a(DE-He213)978-3-319-29746-0 035 $a(MiAaPQ)EBC4587051 035 $a(PPN)194516539 035 $a(EXLCZ)993710000000746175 100 $a20160709d2017 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$aCarbon Nanotubes for Interconnects $eProcess, Design and Applications /$fedited by Aida Todri-Sanial, Jean Dijon, Antonio Maffucci 205 $a1st ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (XII, 333 p. 167 illus., 133 illus. in color.) 311 $a3-319-29744-9 320 $aIncludes bibliographical references at the end of each chapters. 327 $aInterconnect challenges for 2D and 3D Integration -- Overview of Carbon Nanotube Physical Properties -- Overview of Carbon Nanotube Processing Methods -- Electrical Conductivity of Carbon Nanotubes ? Modeling and Characterization -- Computational Studies of Thermal Transport Properties of Carbon Nanotube Material -- Overview of Carbon Nanotubes for Horizontal On-Chip Interconnects -- Carbon Nanotubes as Vertical Interconnects for 3D ICs -- Carbon Nanotubes as Micro-Bumps for 3D Integration -- Electrothermal Modeling of Carbon Nanotubes TSVs -- Exploring Carbon Nanotubes for 3D Power Delivery Networks -- Carbon Nanotubes for Monolithic 3D ICs. 330 $aThis book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in order to improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be first to provide a coherent overview of exploiting carbon nanotubes for 3D interconnects covering aspects from processing, modeling, simulation, characterization and applications. Coverage also includes a thorough presentation of the application of CNTs as horizontal on-chip interconnects which can potentially revolutionize the nanoelectronics industry. This book is a must-read for anyone interested in the state-of-the-art on exploiting carbon nanotubes for interconnects for both 2D and 3D integrated circuits. Provides a single-source reference on carbon nanotubes for interconnect applications; Includes complete coverage of current Cu-based interconnect problems for both 2D and 3D interconnects; Covers topics from modeling, simulation, analysis, design and characterization, in order to provide a broad view of the application of carbon nanotubes for interconnects. 606 $aElectronic circuits 606 $aMicroprocessors 606 $aCircuits and Systems$3https://scigraph.springernature.com/ontologies/product-market-codes/T24068 606 $aProcessor Architectures$3https://scigraph.springernature.com/ontologies/product-market-codes/I13014 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 615 0$aElectronic circuits. 615 0$aMicroprocessors. 615 14$aCircuits and Systems. 615 24$aProcessor Architectures. 615 24$aElectronic Circuits and Devices. 676 $a621.3815 702 $aTodri-Sanial$b Aida$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aDijon$b Jean$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aMaffucci$b Antonio$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910254168803321 996 $aCarbon Nanotubes for Interconnects$92262074 997 $aUNINA