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100   $a19850705d1985      uy             0
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 00$aDelamination and debonding of materials $ea symposium sponsored by ASTM Committees D-30 on High Modulus Fibers and Their Composites and E-24 on Fracture Testing, Pittsburgh, Pa., 8-10 Nov. 1983 /$fW.S. Johnson, editor$b[electronic resource]
210 0 $aPhiladelphia, Pa. $cASTM$dc1985
215   $a1 online resource (503 p. )$cill. ;
225 0 $aASTM special technical publication  Delamination and debonding of materials 
225  0$aASTM special technical publication ;$v876
300   $aPapers presented at the ASTM Symposium on Delamination and Debonding of Materials, held in Pittsburgh, Pa., on Nov. 8-10, 1983.
300   $a"ASTM publication code number (PCN) 04-876000-33."
311   $a0-8031-0414-6 
320   $aIncludes bibliographies and index.
606   $aLaminated materials$xDeterioration$vCongresses
606   $aComposite materials$xDeterioration$vCongresses
606   $aLaminated materials$xCongresses$xDeterioration
606   $aComposite materials$xCongresses$xDelamination
606   $aChemical & Materials Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
606   $aMaterials Science$2HILCC
615  0$aLaminated materials$xDeterioration
615  0$aComposite materials$xDeterioration
615  0$aLaminated materials$xCongresses$xDeterioration
615  0$aComposite materials$xCongresses$xDelamination
615  7$aChemical & Materials Engineering
615  7$aEngineering & Applied Sciences
615  7$aMaterials Science
676   $a620.1/923
701   $aJohnson$b W. S$g(W. Steven)$0366543
712 02$aASTM Committee D-30 on High Modulus Fibers and Their Composites.
712 02$aASTM Committee E-24 on Fracture Testing.
712 12$aASTM Symposium on Delamination and Debonding of Materials$f(1983 :$ePittsburgh, Pa.)
801  0$bDLC
801  1$bDLC
906   $aBOOK
912   $a9910164708203321
996   $aDelamination and debonding of materials$92296641
997   $aUNINA
999   $aThis Record contains information from the Harvard Library Bibliographic Dataset, which is provided by the Harvard Library under its Bibliographic Dataset Use Terms and includes data made available by, among others the Library of Congress