LEADER 05400nam 22007455 450 001 9910163046303321 005 20251116171202.0 010 $a3-319-44586-3 024 7 $a10.1007/978-3-319-44586-1 035 $a(CKB)3710000001041152 035 $a(DE-He213)978-3-319-44586-1 035 $a(MiAaPQ)EBC4791270 035 $a(PPN)198340702 035 $a(EXLCZ)993710000001041152 100 $a20170125d2017 u| 0 101 0 $aeng 135 $aurnn|008mamaa 181 $ctxt$2rdacontent 182 $cc$2rdamedia 183 $acr$2rdacarrier 200 10$a3D Microelectronic Packaging $eFrom Fundamentals to Applications /$fedited by Yan Li, Deepak Goyal 205 $a1st ed. 2017. 210 1$aCham :$cSpringer International Publishing :$cImprint: Springer,$d2017. 215 $a1 online resource (IX, 463 p. 331 illus., 253 illus. in color.) 225 1 $aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v57 311 08$a3-319-44584-7 320 $aIncludes bibliographical references and index. 327 $aIntroduction to 3D Microelectronic Packaging.-3D packaging architecture and assembly process design.-Materials and Processing of TSV.-Microstructural and Reliability Issues of TSV -- Fundamentals and failures in Die preparation for 3D packaging.-Direct Cu to Cu bonding and other alternative bonding techniques in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2.5/3D Packages -- Fundamentals of solder alloys in 3D packaging.-Fundamentals of Electromigration in interconnects of 3D packages.-Fundamentals of heat dissipation in 3D IC packaging -- Fundamentals of advanced materials and processes in organic substrate technology -- Die and Package Level Thermal and Thermal/Moisture Stresses in 3-D Packaging: Modeling and Characterization -- Processing and Reliability of Solder Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation and failure analysis of 3D packaging. . 330 $aThis volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis Discusses 3D electronic package architecture and assembly process design Features contributions from both academic and industry authors, for a complete view of this important technology. 410 0$aSpringer Series in Advanced Microelectronics,$x1437-0387 ;$v57 606 $aElectronics 606 $aMicroelectronics 606 $aOptical materials 606 $aElectronics$xMaterials 606 $aElectronic circuits 606 $aBiotechnology 606 $aNanotechnology 606 $aMetals 606 $aElectronics and Microelectronics, Instrumentation$3https://scigraph.springernature.com/ontologies/product-market-codes/T24027 606 $aOptical and Electronic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z12000 606 $aElectronic Circuits and Devices$3https://scigraph.springernature.com/ontologies/product-market-codes/P31010 606 $aMicroengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/C12040 606 $aNanotechnology and Microengineering$3https://scigraph.springernature.com/ontologies/product-market-codes/T18000 606 $aMetallic Materials$3https://scigraph.springernature.com/ontologies/product-market-codes/Z16000 615 0$aElectronics. 615 0$aMicroelectronics. 615 0$aOptical materials. 615 0$aElectronics$xMaterials. 615 0$aElectronic circuits. 615 0$aBiotechnology. 615 0$aNanotechnology. 615 0$aMetals. 615 14$aElectronics and Microelectronics, Instrumentation. 615 24$aOptical and Electronic Materials. 615 24$aElectronic Circuits and Devices. 615 24$aMicroengineering. 615 24$aNanotechnology and Microengineering. 615 24$aMetallic Materials. 676 $a621.381 702 $aLi$b Yan$4edt$4http://id.loc.gov/vocabulary/relators/edt 702 $aGoyal$b Deepak$4edt$4http://id.loc.gov/vocabulary/relators/edt 906 $aBOOK 912 $a9910163046303321 996 $a3D Microelectronic Packaging$91934663 997 $aUNINA