LEADER 02089nam 22004813u 450 001 9910158897503321 005 20230807221600.0 010 $a1-68195-078-2 035 $a(CKB)3710000000462092 035 $a(EBL)2128932 035 $a(SSID)ssj0001611822 035 $a(PQKBManifestationID)16335999 035 $a(PQKBTitleCode)TC0001611822 035 $a(PQKBWorkID)14912755 035 $a(PQKB)11140666 035 $a(Exl-AI)993710000000462092 035 $a(EXLCZ)993710000000462092 100 $a20150817d2015|||| u|| | 101 0 $aeng 135 $aur|n|---||||| 181 $ctxt 182 $cc 183 $acr 200 14$aThe Witness 210 $aTustin $cXist Publishing$d2015 215 $a1 online resource (377 p.) 225 1 $aXist Classics 300 $aDescription based upon print version of record. 327 $aCHAPTER I; CHAPTER II; CHAPTER III; CHAPTER IV; CHAPTER V; CHAPTER VI; CHAPTER VII; CHAPTER VIII; CHAPTER IX; CHAPTER X; CHAPTER XI; CHAPTER XII; CHAPTER XIII; CHAPTER XIV; CHAPTER XV; CHAPTER XVI; CHAPTER XVII; CHAPTER XVIII; CHAPTER XIX; CHAPTER XX; CHAPTER XXI; CHAPTER XXII; CHAPTER XXIII; CHAPTER XXIV; CHAPTER XXV; CHAPTER XXVI; CHAPTER XXVII; CHAPTER XXVIII; CHAPTER XXIX; CHAPTER XXX; CHAPTER XXXI; CHAPTER XXXII; CHAPTER XXXIII; CHAPTER XXXIV; CHAPTER XXXV; CHAPTER XXXVI 330 $a A Wholesome Christian Romance from Grace Livingston Hill Paul Courtland must choose between his two loves in this retelling of the New Testament story of the apostle Paul. This Christian novel by Grace Livingston Hill has delighted readers for generations and features a clean and beautiful romance story. 410 0$aXist Classics 606 $aChristian fiction$7Generated by AI 606 $aRomance fiction$7Generated by AI 615 0$aChristian fiction 615 0$aRomance fiction 700 $aHill$b Grace Livingston$0816561 801 0$bAU-PeEL 801 1$bAU-PeEL 801 2$bAU-PeEL 906 $aBOOK 912 $a9910158897503321 996 $aThe Witness$93407215 997 $aUNINA LEADER 03614nam 22005894a 450 001 9910963455303321 005 20251116210451.0 010 $a1-61503-093-X 035 $a(CKB)2560000000049842 035 $a(EBL)3002391 035 $a(OCoLC)729262390 035 $a(SSID)ssj0000485519 035 $a(PQKBManifestationID)11307144 035 $a(PQKBTitleCode)TC0000485519 035 $a(PQKBWorkID)10603902 035 $a(PQKB)10073509 035 $a(MiAaPQ)EBC3002391 035 $a(Au-PeEL)EBL3002391 035 $a(CaPaEBR)ebr10320384 035 $a(BIP)12443472 035 $a(EXLCZ)992560000000049842 100 $a20050525d2005 uy 0 101 0 $aeng 135 $aurcn||||||||| 181 $ctxt 182 $cc 183 $acr 200 00$aLead-free solder interconnect reliability /$fedited by Dongkai Shangguan 205 $a1st ed. 210 $aMaterials Park, OH $cASM International$d2005 215 $a1 online resource (302 p.) 300 $aDescription based upon print version of record. 311 08$a0-87170-816-7 320 $aIncludes bibliographical references and index. 327 $a""Contents""; ""Foreword""; ""Preface""; ""Lead-Free Soldering and Environmental Compliance: An Overview""; ""Microstructural Evolution and Interfacial Interactions in Lead-Free Solder Interconnects""; ""Fatigue and Creep of Lead-Free Solder Alloys: Fundamental Properties""; ""Lead-Free Solder Joint Reliability Trends""; ""Chemical Interactions and Reliability Testing for Lead-Free Solder Interconnects""; ""Tin Whisker Growth on Lead-Free Solder Finishes""; ""Accelerated Testing Methodology for Lead-Free Solder Interconnects"" 327 $a""Thermomechanical Reliability Prediction of Lead-Free Solder Interconnects""""Design for Reliability Finite Element Modeling of Lead-Free Solder Interconnects""; ""Characterization and Failure Analyses of Lead-Free Solder Defects""; ""Reliability of Interconnects with Conductive Adhesives""; ""Lead-Free Solder Interconnect Reliability Outlook""; ""Index"" 330 $aThis book provides the most up-to-date knowledge and data available on the reliability of lead-free solder interconnects. The content has been written by leading experts working in this important technology area. Both fundamental research and practical considerations are addressed. Environmental regulations are driving the worldwide adoption of lead-free soldering technology for electronics packaging, board assembly, and related manufacturing operations. While a significant amount of research and development work has been conducted in recent years on manufacturing issues to enable the conversion to lead-free solders, data from studies related to the reliability of lead-free solder interconnects are still emerging. Many research projects around the world have been undertaken to study lead-free solder reliability under different loading conditions. This book is the first comprehensive guide to reliability of lead-free solder interconnects. 606 $aMicroelectronic packaging$xReliability 606 $aSolder and soldering 606 $aLead-free electronics manufacturing processes 615 0$aMicroelectronic packaging$xReliability. 615 0$aSolder and soldering. 615 0$aLead-free electronics manufacturing processes. 676 $a621.381/046 701 $aShangguan$b Dongkai$f1963-$01868863 801 0$bMiAaPQ 801 1$bMiAaPQ 801 2$bMiAaPQ 906 $aBOOK 912 $a9910963455303321 996 $aLead-free solder interconnect reliability$94476908 997 $aUNINA