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005 20230810001430.0
010   $a1-315-35194-3
010   $a1-315-36894-3
010   $a1-4987-4382-X
024 7 $a10.1201/9781315368948 
035   $a(CKB)3710000000960827
035   $a(MiAaPQ)EBC4748374
035   $a(OCoLC)966358842
035   $a(EXLCZ)993710000000960827
100   $a20180706h20172017  uy             0
101 0 $aeng
135   $aurcnu||||||||
181   $2rdacontent
182   $2rdamedia
183   $2rdacarrier
200 00$aSemiconductor devices in harsh conditions /$fedited by Kirsten Weide-Zaage, Malgorzata Chrzanowska-Jeske ; managing editor, Krzysztof Iniewski
210  1$aBoca Raton :$cCRC Press,$d[2017]
210  4$dİ2017
215   $a1 online resource (257 pages)
225 1 $aDevices, Circuits, and Systems
311   $a1-4987-4380-3 
320   $aIncludes bibliographical references at the end of each chapters and index.
327   $asection I. Radiation -- section II. Sensors and operating conditions -- section III. Packaging and system design.
410  0$aDevices, circuits, and systems.
606   $aSemiconductors$xReliability
606   $aExtreme environments
606   $aEnvironmental testing
615  0$aSemiconductors$xReliability.
615  0$aExtreme environments.
615  0$aEnvironmental testing.
676   $a621.3815/2
702   $aChrzanowska-Jeske$b Malgorzata
702   $aWeide-Zaage$b Kirsten
801  0$bFlBoTFG
801  1$bFlBoTFG
906   $aBOOK
912   $a9910153183603321
996   $aSemiconductor devices in harsh conditions$92287503
997   $aUNINA