LEADER 01602nam  2200469   450 
001 9910148727703321
005 20111110082124.0
010   $a1-61728-260-X
035   $a(CKB)3710000000922264
035   $a(MiAaPQ)EBC4743790
035   $a(EXLCZ)993710000000922264
100   $a20100421h20112011  uy|            0
101 0 $aeng
135   $aurcnu||||||||
181   $2rdacontent
182   $2rdamedia
183   $2rdacarrier
200 10$aElectroplating of lead free solder for electronics /$fShany Joseph and Girish Phatak
210  1$aHauppauge, New York :$cNova Science Publishers,$d[2011]
210  4$dİ2011
215   $a1 online resource (69 pages) $cillustrations
225 1 $aElectrical engineering developments
300   $aIncludes bibliographical references and index.
311   $a1-61668-753-3 
327   $aThe changing face of soldering in electronics -- Options in solder materials -- Electroplating baths for promising lead-free system.
410  0$aElectrical engineering developments series.
606   $aLead-free electronics manufacturing processes
606   $aElectroplating
606   $aSolder and soldering
615  0$aLead-free electronics manufacturing processes.
615  0$aElectroplating.
615  0$aSolder and soldering.
676   $a621.381
700   $aJoseph$b Shany$01239525
702   $aPhatak$b Girish
801  0$bMiAaPQ
801  1$bMiAaPQ
801  2$bMiAaPQ
906   $aBOOK
912   $a9910148727703321
996   $aElectroplating of lead free solder for electronics$92875982
997   $aUNINA