LEADER 01489oam 2200493zu 450 001 9910145722903321 005 20241212215705.0 010 $a9781509078103 010 $a150907810X 010 $a9781424419128 010 $a1424419123 035 $a(CKB)1000000000710929 035 $a(SSID)ssj0000453263 035 $a(PQKBManifestationID)12168545 035 $a(PQKBTitleCode)TC0000453263 035 $a(PQKBWorkID)10481227 035 $a(PQKB)10195092 035 $a(NjHacI)991000000000710929 035 $a(EXLCZ)991000000000710929 100 $a20160829d2008 uy 101 0 $aeng 135 $aur||||||||||| 181 $ctxt 182 $cc 183 $acr 200 10$a2008 IEEE International Interconnect Technology Conference 210 31$a[Place of publication not identified]$cI E E E$d2008 215 $a1 online resource 300 $aBibliographic Level Mode of Issuance: Monograph 311 08$a9781424419111 311 08$a1424419115 606 $aSemiconductors$xDesign and construction$vCongresses 606 $aSemiconductors$xJunctions 606 $aElectric contacts$vCongresses 615 0$aSemiconductors$xDesign and construction 615 0$aSemiconductors$xJunctions. 615 0$aElectric contacts 676 $a621.317 702 $aIEEE Staff 801 0$bPQKB 906 $aPROCEEDING 912 $a9910145722903321 996 $a2008 IEEE International Interconnect Technology Conference$92534721 997 $aUNINA