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101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1st Electronics Systemintegration Technology Conference : Dresden, Saxony, Germany : 2006 proceedings
210 31$a[Place of publication not identified]$cIEEE$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311 08$a9781424405527 
311 08$a1424405521 
606   $aElectronic packaging$vCongresses
606   $aMicroelectronics$vCongresses
606   $aIntegrated circuits$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  0$aMicroelectronics
615  0$aIntegrated circuits
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aInstitute of Electrical and Electronics Engineers
712 12$aElectronics Systemintegration Technology Conference
801  0$bPQKB
906   $aPROCEEDING
912   $a9910145690503321
996   $a1st Electronics Systemintegration Technology Conference : Dresden, Saxony, Germany : 2006 proceedings$92536787
997   $aUNINA