LEADER 01819oam  2200517zu 450 
001 9910145690503321
005 20210807003119.0
010   $a1-5090-9213-7
010   $a1-4244-0553-X
035   $a(CKB)1000000000711162
035   $a(SSID)ssj0000394664
035   $a(PQKBManifestationID)12155817
035   $a(PQKBTitleCode)TC0000394664
035   $a(PQKBWorkID)10425852
035   $a(PQKB)11045507
035   $a(EXLCZ)991000000000711162
100   $a20160829d2006      uy 
101 0 $aeng
181   $ctxt
182   $cc
183   $acr
200 10$a1st Electronics Systemintegration Technology Conference : Dresden, Saxony, Germany : 2006 proceedings
210 31$a[Place of publication not identified]$cIEEE$d2006
300   $aBibliographic Level Mode of Issuance: Monograph
311   $a1-4244-0552-1 
606   $aElectronic packaging$vCongresses
606   $aMicroelectronics$vCongresses
606   $aIntegrated circuits$vCongresses
606   $aElectrical & Computer Engineering$2HILCC
606   $aElectrical Engineering$2HILCC
606   $aEngineering & Applied Sciences$2HILCC
615  0$aElectronic packaging
615  0$aMicroelectronics
615  0$aIntegrated circuits
615  7$aElectrical & Computer Engineering
615  7$aElectrical Engineering
615  7$aEngineering & Applied Sciences
676   $a621.381/046
712 02$aComponents, Packaging & Manufacturing Technology Society
712 02$aInstitute of Electrical and Electronics Engineers
712 12$aElectronics Systemintegration Technology Conference
801  0$bPQKB
906   $aPROCEEDING
912   $a9910145690503321
996   $a1st Electronics Systemintegration Technology Conference : Dresden, Saxony, Germany : 2006 proceedings$92536787
997   $aUNINA